Principal Electrical Engineer

Nokia; Ottawa; On-site; CAD 140,000 - 190,000; Full time

Benefits offered by this job

Competitive compensation

Excellent benefits

Job summary

Nokia is seeking a Principal Electrical Engineer in Ottawa to lead electro-optical technology development, from concept through high-volume production. You will guide SI/PI accuracy and apply advanced substrates to optimize module designs and interconnects.

With 10+ years in electrical engineering, you will mentor cross-functional teams, ensure robust manufacturing processes for SMT and micro-electronics, and drive innovative productization across the lifecycle.

Qualifications

• Bachelor's or Master's degree in Electrical Engineering or related field.
• 10+ years of experience in electrical engineering with emphasis on SI/PI.
• Expertise in advanced substrate technologies (organic build-up, mSAP, HDI PCB).
• Strong knowledge of SMT and micro-electronics manufacturing processes.
• Experience with mechanical analysis tools (FEA, thermal analysis) is valued.

Responsibilities

• Lead technology development for electro-optical modules and productization.
• Provide guidance in SI & PI to enhance performance and reliability.
• Apply advanced substrates to optimize high-frequency interconnects and designs.
• Oversee manufacturing processes for SMT and micro-electronics.
• Mentor cross-functional engineering teams and drive continuous improvement.
• Collaborate with stakeholders to ensure seamless integration of electrical solutions.

Skills

Electrical engineering

Signal integrity

Power integrity

HDI PCB

Advanced substrates

Team leadership

Mentoring

Cross-functional collaboration

Manufacturing processes

Thermal analysis

Education

Bachelor's or Master's in Electrical Engineering

Job description

Job Description

We are seeking a highly motivated and technically accomplished Principal Electrical Engineer to lead technology development initiatives for next-generation electro-optical products. This role is responsible for driving the evaluation, development, and productization of emerging technologies while providing technical leadership throughout the complete product lifecycle, from concept and feasibility through new product introduction (NPI) and high-volume manufacturing.

The successful candidate will possess deep expertise in high-speed electrical design, signal integrity (SI), power integrity (PI), advanced packaging technologies, and product development processes. This individual will serve as a key technical leader, collaborating across multidisciplinary teams to enable innovative optical communication solutions and mentor the next generation of engineering talent.

How You Will Contribute And What You Will Learn

• Drive technology development for electro-optical modules, ensuring industry leadership and innovation.
• Provide expertise and guidance in SI & PI to enhance product performance and reliability.
• Apply knowledge of advanced substrates (organic build-up, mSAP, HDI PCB) to optimize module designs and high frequency interconnect.
• Understand and optimize manufacturing processes for SMT and micro-electronics.
• Oversee mechanical analysis (FEA, thermal analysis) to ensure robust and efficient designs.
• Lead technology evolution programs, evaluating the readiness of new technologies for productization.
• Execute technology assessments, deep-diving into new technologies to identify opportunities and challenges.
• Provide mentorship to the cross functional engineering team, fostering a culture of knowledge sharing and continuous improvement.
• Collaborate with cross-functional teams to ensure seamless integration of electrical engineering solutions.

Key Skills And Experience

• Bachelor's or Master's degree in Electrical Engineering or a related field.
• Minimum 10 years of experience in electrical engineering, with a focus on signal integrity and power integrity.
• Proven expertise in advanced substrate technologies (organic build-up, mSAP, HDI PCB) is essential.
• Strong understanding of manufacturing processes for SMT and micro-electronics.
• Understanding of mechanical analysis tools (FEA, thermal analysis) is highly desirable.
• Ability to lead and mentor a team, fostering a collaborative and innovative work environment.
• Excellent communication and interpersonal skills for effective collaboration with cross-functional teams.
• Analytical mindset with a problem-solving approach to complex engineering challenges.
• Willingness to stay updated with industry trends and emerging technologies.
• Ability to work independently and manage multiple projects simultaneously.