Silicon Photonics Packaging Lead (Flip Chip & Fanout)

Nokia; Ottawa; On-site; CAD 90,000 - 120,000; Full time

Job summary

Nokia is seeking a Packaging Development Engineer to lead the development of next-generation packaging solutions for silicon photonics and high‑speed electronics. You will own all advanced packaging activities—from flip chip to wirebonding—and oversee production readiness with cross‑functional teams.

Responsibilities include optimizing assembly, maintaining documentation and BOMs, and supporting contract manufacturers to ensure a smooth transition to mass production.

Qualifications

• 5–8 years in high-speed electronics and silicon photonics packaging.
• Experience with flip chip, fanout, thermo‑compression bonding, underfill, hot bar soldering, wirebonding, die attach.
• Experience in microelectronics and optoelectronics packaging.
• Knowledge of materials properties and multilayer interfaces after bonding.
• Experience with high-volume packaging of optical transceivers and co-packaged optics.
• Proficient in documenting fabrication, inspection and assembly processes.
• Strong interpersonal and problem-solving skills to interact with vendors and contractors.

Responsibilities

• Lead next generation Silicon Photonics package design with cross-functional teams and vendors.
• Own all development of advanced packaging activities and designs: flip chip, reflow, fanout, underfill, wirebonding.
• Optimize assembly of electrical and optical engines for production volumes and cost targets.
• Survey advanced SiPh packaging solutions, materials and vendors for new tech.
• Maintain process and manufacturing documentation, including BOMs for new products.
• Drive package debugging during product validation and qualification.
• Support development activities at Contract Manufacturers, remotely and on-site for smooth mass production transition.

Skills

Silicon Photonics

High-speed electronics

Flip chip

Fanout

Thermo‑compression bonding

Wirebonding

Underfill

Die attach

Reflow

Metrology

Tools

SEM/XSEM

Confocal microscopy

Acoustic imaging

Job description

Nokia is seeking a Packaging Development Engineer to lead the development of next-generation packaging solutions for silicon photonics and high‑speed electronics. You will own all advanced packaging activities—from flip chip to wirebonding—and oversee production readiness with cross‑functional teams.

Responsibilities include optimizing assembly, maintaining documentation and BOMs, and supporting contract manufacturers to ensure a smooth transition to mass production.