Optical Packaging Engineer – AI & Data Center Modules

Lumentum; Ottawa; On-site; CAD 187,000 - 266,000; Full time

Benefits offered by this job

Flexible time off

Wellness benefits

Tuition reimbursement

Gym facility

Subsidized meals

Stock options

Collaborative culture

Job summary

Lumentum seeks a Mechanical Engineer to design mechanical packaging for high-speed optical modules used in AI and data-center interconnects. You will drive concepts from architecture through prototyping, validation, and production ramp, delivering 3D CAD models and documentation.

You will perform advanced thermal and structural analyses, own GD&T and tolerance stack-ups, and collaborate across optical, electrical, thermal, and manufacturing teams to enable scalable, cost-effective platforms.

Qualifications

• Experience in mechanical design for high-speed optical modules.
• Familiarity with thermal management and high-density packaging.
• Ability to work in a fast-paced R&D/NPI environment.

Responsibilities

• Design and develop mechanical packaging solutions for high-speed optical modules used in AI and data center interconnect systems.
• Drive architecture definition through detailed design, prototype, validation, and production ramp.
• Develop 3D CAD models and engineering documentation.
• Perform advanced thermal and mechanical stress analyses (FEA).
• Own GD&T definition and tolerance stack-up analysis for high-density assemblies.
• Design fixtures, tooling, and test infrastructure for optical alignment and validation.
• Collaborate with optical, electrical, thermal, reliability, manufacturing and supply-chain teams.
• Provide technical direction, review designs, and mentor junior engineers for senior roles.

Skills

SolidWorks

FloTHERM

Thermal analysis

GD&T

DFM/DFA

Packaging design

Scripting (VB/C/MATLAB)

Cross-functional collaboration

Education

B.S. in Mechanical Engineering

M.S./Ph.D. preferred

Tools

SolidWorks

FloTHERM

JMP

Job description

Lumentum seeks a Mechanical Engineer to design mechanical packaging for high-speed optical modules used in AI and data-center interconnects. You will drive concepts from architecture through prototyping, validation, and production ramp, delivering 3D CAD models and documentation.

You will perform advanced thermal and structural analyses, own GD&T and tolerance stack-ups, and collaborate across optical, electrical, thermal, and manufacturing teams to enable scalable, cost-effective platforms.