Lead Staff Mechanical Engineer-FEA

Nokia

Ottawa

Hybrid

CAD 90,000 - 130,000

Full time

14 days+
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Benefits offered by this job

Flexible work arrangements
Health and wellness programs
Learning opportunities
Competitive salary

Job summary

Nokia in Ottawa is seeking a Staff Mechanical Engineer – Technical Lead to design optical pluggable modules. You will work hands-on from simulations to prototyping and influence product outcomes within a collaborative team.

You will lead thermal/structural design efforts, perform FEA, and create CAD models and drawings for production. Strong communication and leadership are essential for success in this role.

Qualifications

  • Bachelor’s or Master’s degree in Mechanical Engineering.
  • 10+ years of mechanical design experience, especially in optical or telecom hardware.
  • Strong expertise in thermal design, FEA, and CAD modeling (Creo preferred).
  • Proficiency in die stress/strain simulations.
  • Excellent communication and leadership skills.

Responsibilities

  • Design mechanical components for optical modules focusing on thermal and structural manufacturability.
  • Perform and supervise thermal simulations and FEA to optimize designs.
  • Collaborate with system teams to create innovative die interconnect solutions.
  • Create and review CAD models and detailed drawings for precision manufacturing.
  • Conduct tolerance and stress analyses and thermal design validation testing.
  • Develop prototypes and transition from design to production with minimal redesigns.
  • Engage with suppliers and contract manufacturers to troubleshoot issues.
  • Author and review ECOs, BOMs, and technical documentation.

Skills

Thermal design
FEA
CAD modeling
Die stress simulations
Leadership

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

Creo

Job description

Job Description

In this role as a Staff Mechanical Engineer – Technical Lead, you'll be at the forefront of designing next-generation optical pluggable modules. You'll collaborate within a dynamic team of skilled engineers, fostering an innovative environment where your expertise shapes breakthrough solutions. Your work will involve hands‑on engineering, from simulations to prototyping, ensuring products meet industry standards. You'll enjoy a supportive culture that emphasizes professional growth and knowledge sharing. Benefits include a competitive salary, flexible work arrangements, health and wellness programs, and opportunities for continuous learning.

How You Will Contribute And What You Will Learn

Design and develop mechanical components for optical pluggable modules, focusing on thermal, structural, and manufacturability aspects.

  • Perform and supervise thermal simulations and finite element analysis (FEA) to optimize designs.
  • Collaborate with system integration teams to create innovative die interconnect solutions exceeding 140GHz bandwidth.
  • Create and review CAD models and detailed engineering drawings for precision manufacturing.
  • Conduct tolerance and stress analyses, along with thermal design validation testing (DVT).
  • Develop prototypes and facilitate the transition from design to production, minimizing redesign efforts.
  • Engage with suppliers and contract manufacturers to troubleshoot mechanical and integration challenges.
  • Author and review engineering change orders (ECOs), bill of materials (BOMs), and technical documentation.
Key Skills And Experience
Must-Have
  • Bachelor’s or Master’s degree in Mechanical Engineering
  • 10+ years of experience in mechanical design, particularly with optical or telecom hardware
  • Strong expertise in thermal design, FEA, and CAD modeling (Creo preferred)
  • Proficiency in conducting die stress/strain simulations
  • Excellent communication and leadership skills
Nice-To-Have
  • Experience with optical transceiver packaging (e.g., QSFP, OSFP)
  • Knowledge of compliance and shock/vibration testing for telecom applications
  • Familiarity with advanced substrate technologies like LTCC and HTCC
  • Experience in new product introduction (NPI) processes
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