Optical Packaging – Assembly Engineer

Jobtailor; Coquitlam; On-site; CAD 90,000 - 120,000; Full time

Job summary

Jobtailor in Canada seeks an experienced optical packaging engineer to develop and implement production-ready packaging for integrated photonic devices. The role emphasizes high-precision optical alignment and data-driven optimization to ensure robust, scalable manufacturing.

You will lead cross-functional efforts with design, device, test, and manufacturing teams, establishing SOPs and contributing to NPI through DfX methodologies (DfM, DfT, DfR).

Qualifications

• PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline.
• Hands-on experience with integrated photonics and optics.
• 3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification.
• Working experience in new product introduction.
• Excellent teamwork, interpersonal and written communication skills.
• Good organization and problem solving skills.
• Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits.
• Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes.
• Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability.
• Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR).
• Cover letter with resume in one file.

Responsibilities

• Develop and implement optical packaging and assembly processes for photonic devices.
• Design and validate alignment methods and tooling for accuracy and throughput.
• Establish validation plans and characterize optical performance under relevant conditions.
• Define scalable workflows, SOPs, and process controls for consistency.
• Support New Product Introduction with cross-functional teams.
• Develop assembly stations with precision motion, metrology, and environmental control.
• Analyze data to identify yield drivers and improve throughput, repeatability, and stability.
• Collaborate across teams to create robust packaging solutions.
• Define qualification criteria and acceptance standards for product release.

Skills

Optical packaging

High-precision alignment

NPI collaboration

DfX methodologies

Data-driven optimization

Education

PhD or Master’s degree in physics/engineering

Tools

Optical metrology

Environmental control

Precision motion systems

Packaging design tools

Job description

• Develop and implement optical packaging and assembly processes for integrated photonic devices, including high-precision active alignment to achieve optimal coupling efficiency and long-term stability
• Design, validate, and optimize alignment methods and tooling to improve accuracy, throughput, and repeatability
• Establish validation plans and characterize optical performance under relevant operating conditions
• Define scalable workflows, SOPs, and process controls to ensure consistent manufacturing outcomes
• Support New Product Introduction by partnering with design, device, test, and manufacturing teams to apply Design for Excellence methodologies, including Design for Manufacturability, Design for Test, and Design for Reliability
• Develop assembly stations integrating precision motion, optical metrology, and environmental control
• Analyze assembly, process, and test data to identify yield drivers, root causes, failure mechanisms, and opportunities for improved throughput, repeatability, and stability
• Collaborate across teams to develop robust, manufacturable packaging solutions
• Define qualification criteria and acceptance standards to support product release

Requirements

• PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline
• Knowledge of and hands-on-experience with integrated photonics and optics
• 3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification
• Working experience in new product introduction
• Excellent teamwork, interpersonal and written communication skills
• Good organization and problem solving skills
• Strong attention to detail
• Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits
• Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes
• Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability
• Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR)
• Cover letter with resume in one file

Core Competencies

Demonstrates expertise in developing and implementing optical packaging processes for integrated photonic devices, with a strong focus on high-precision optical alignment and data-driven process optimization. Proven ability to collaborate across teams and apply Design for Excellence methodologies to ensure robust, manufacturable solutions.

Highest-signal resume keywords

• PhD Or Master’s Degree In Physics
• Integrated Photonics And Optics
• High-Precision Optical Alignment
• Data-Driven Process Optimization
• New Product Introduction (NPI)

Hard Skills

• Optical Packaging Processes
• Alignment Methods And Tooling
• Optical Performance Characterization
• Process Controls And SOPs
• Photonic Integrated Circuit Design
• Semiconductor Packaging Design
• Optoelectronic Packaging
• Fiber Optic Packaging
• Data Analysis For Yield Improvement
• Design For Excellence (DfX) Methodologies

Soft Skills

• Teamwork
• Interpersonal Communication
• Written Communication
• Organization
• Problem Solving
• Attention To Detail

Industry Keywords

• Photonic Integrated Circuits
• Packaging Engineering
• Design For Manufacturability (DfM)
• Design For Test (DfT)
• Design For Reliability (DfR)

Tools & Technologies

• Precision Motion Systems
• Optical Metrology
• Environmental Control Systems