AI-Driven SI/PI Engineer for High-Speed Interconnects

ciena

Ottawa

On-site

CAD 75,000 - 120,000

Full time

14 days+

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Benefits offered by this job

Medical coverage

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Job summary

Ciena seeks a Signal Integrity/Power Integrity (SI/PI) Engineer to contribute to high-speed interconnect and chip designs for AI-driven networking systems. You will work across simulation, analysis, and laboratory validation to advance interconnect technologies for next-generation networking performance.

The role involves collaborating with cross-functional teams, building EM models, and validating SI/PI results in the lab.

Qualifications

Master's degree in Electrical Engineering or Bachelor's in Electrical Engineering or related discipline.
Experience with SI/PI simulation and analysis tools (HFSS, SIwave, ADS, Sigrity, MATLAB).
Experience with EDA tools (Cadence Allegro or similar).
Knowledge of PCB/package design, high-speed signaling, PDN, IR drop, transmission lines.

Responsibilities

Collaborate with cross-functional teams to design interconnect structures for ASIC packages and high-speed transitions.
Build 2D/3D EM models for simulation and analysis.
Perform SI and PI simulations and validate with laboratory measurements.
Characterize interconnect performance from simulations to meet link requirements.
Document findings and present results to teams.