Senior Engineer, Process Integration, NTI NAND

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Região Norte; On-site; BRL 470,000 - 705,000; Full time

Job summary

Micron Technology Inc. in Singapore's R&D department is seeking a Senior NAND Module Process Integration Engineer to design, develop, and implement process solutions for next-generation 3D NAND yield and quality at competitive cost and performance.

You will lead cross-functional teams to address defects and gaps, while defining CSPEC criteria and coordinating funding for experiments and transitions to manufacturing.

Qualifications

• BS, MS or PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or related field.
• Proficiency in scripting/analytics software such as Python, Tableau, Power BI desirable.
• Minimum 3 years of experience in Process Integration and Yield Enhancement in semiconductors.

Responsibilities

• Identify and quantify module deficiencies and technology gaps; lead cross-functional teams to improve processes.
• Develop or redefine CSPEC criteria for optimal product performance and drive manufacturing capability.
• Coordinate site activities to secure funding for experiments and conversions and communicate decisions to R&D, Product Engineering and Manufacturing partners.
• Undertake development projects to evaluate new integration schemes for alpha and derivative part types and establish proof of concept for future tech nodes.
• Assist in transferring new technology from R&D to manufacturing.
• Contribute to ramp-up and qualification; support documentation and training of module fundamentals.

Skills

Data analysis

Problem solving

Cross-functional teamwork

Communication skills

Education

Electrical Eng / Microelectronics

Tools

Python

SolidWorks

Tableau

Power BI

Job description

As a Senior NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability

• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability

• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners

• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility

• Assist in the transfer of new technology from R&D to manufacturing

• Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Successful candidates for this position,

Must have:

• Passion in semiconductor technology and innovation

• Adept at data analysis, problem-solving, and process integration optimization

• Excellent communication skills and ability to work in cross-functional teams

• Committed to quality, collaboration, and continuous improvement

• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment

• Ability to travel for extended periods to the US for collaborative R&D work

Requirements:

• BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field

• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable

• Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement

• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms

• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable

• Exposure to R&D and transfer/manufacturing is desirable