Staff Engineer, NTI Metrology

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD

Região Norte

Presencial

BRL 300 000 - 420 000

Tempo integral

Há 6 dias
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Resumo da oferta

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD seeks a senior metrology specialist to develop, qualify, and deploy advanced metrology applications for 3D NAND process development, focusing on FIB and AFM/SEM/WLI. You will lead evaluation of next-generation metrology systems, assess measurement capability, throughput, and manufacturability, and collaborate with suppliers to build technology roadmaps.

Requires a PhD or MS in a relevant field and 7+ years of metrology experience with FIB and at least

Qualificações

  • Master's or PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering or Applied Physics.
  • Minimum 7 years of semiconductor metrology development experience with ownership of new metrology applications and inline monitoring.
  • Minimum 5 years hands-on experience in FIB and at least one of AFM, WLI, or SEM.
  • Experience developing metrology applications for process characterization, inline monitoring, yield improvement, and technology transfer.
  • Candidates without direct metrology application development experience will not be considered.

Responsabilidades

  • Own the development, qualification, and deployment of advanced metrology applications for 3D NAND process development with emphasis on FIB and AFM/SEM/WLI.
  • Lead evaluation, qualification, and deployment of next-gen metrology systems and FOAK technologies across FIB, AFM, SEM, and WLI.
  • Establish and drive technology roadmaps aligned with NAND requirements and partnerships with suppliers.
  • Identify modeling opportunities using metrology data analytics, AI, and ML to understand electrical failure signatures.
  • Collaborate with Process Integration, Yield, and Manufacturing teams to enable rapid deployment.

Conhecimentos

FIB
AFM
WLI
SEM
AI/ML analytics

Formação académica

Master's or PhD in Materials Science / Mechanical Engineering / Electrical Engineering / Applied Physics

Ferramentas

Focused Ion Beam (FIB)
AFM
SEM
WLI

Descrição da oferta de emprego

Responsibilities:


  • Own the development, qualification, and deployment of advanced metrology applications for 3D NAND process development, with primary emphasis on Focused Ion Beam (FIB) and one or more of the following:


  • Atomic Force Microscopy (AFM)


  • Optical interferometry or White Light Interferometry (WLI)


  • Scanning Electron Microscopy (SEM)


  • Semiconductor electrical or non-contact characterization methods


  • Develop and implement innovative metrology solutions utilizing FIB, AFM, SEM, and related characterization techniques to close inline detection gaps and accelerate process learning.


  • Lead the evaluation, qualification, and deployment of next-generation metrology systems and First-of-a-Kind (FOAK) technologies, including assessment of measurement capability, accuracy, repeatability, throughput, automation, and manufacturing readiness across FIB, AFM, SEM, and other advanced metrology platforms.


  • Establish and drive technology roadmaps, ensuring alignment with future NAND technology requirements while fostering strong technical partnerships with equipment suppliers and industry collaborators.


  • Identify and develop modeling opportunities using metrology, defect detection, artificial intelligence (AI), and machine learning (ML) techniques in conjunction with metrology data analytics to understand electrical failure signatures observed at probe and their impact on product reliability, yield, and performance.


  • Collaborate closely with Process Integration, Yield Enhancement, Process Development Engineering and Manufacturing teams to develop innovative characterization solutions and enable rapid technology deployment



Qualifications:


  • Master's or PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering or Applied Physics.


  • Minimum 7 years of semiconductor metrology development experience with demonstrated ownership and experience developing new metrology applications, recipes, methodologies or inline monitoring solutionsacross advanced characterization platforms, including FIB and one or more of the following: AFM, SEM, or WLI (not users of Metrology data).


  • Minimum 5 years of hands‑on experience in Focused Ion Beam (FIB) and at least one additional advanced metrology technique from the following


  • Atomic Force Microscopy (AFM)


  • While Light Interferometry (WLI)


  • Scanning Electron Microscopy (SEM)


  • Demonstrated track record developing advanced semiconductor metrology applications for process characterization, inline monitoring, root‑cause analysis, yield improvement, reliability investigations, and technology transfer, including qualification of new metrology technologies and direct engagement with suppliers to establish application capability and technology roadmaps.


  • Candidates whose experience is primarily limited to process engineering, yield engineering, failure analysis, or data analysis roles without direct metrology application development responsibility will not be considered.


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