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Imec in Vlaams-Brabant, Belgium, offers a Master internship focused on RF interposer technology as a heterogeneous integration platform for co-packaged optics. This 6–12 month program invites Master students to explore RF/electronic and photonic chiplet integration, system architectures, and high-speed interconnect design.
The project combines electromagnetic simulation with system-level analysis to derive guidelines for RF-interposer-enabled CPO architectures, contributing to scalable,
Imec in Vlaams-Brabant, Belgium, offers a Master internship focused on RF interposer technology as a heterogeneous integration platform for co-packaged optics. This 6–12 month program invites Master students to explore RF/electronic and photonic chiplet integration, system architectures, and high-speed interconnect design.
The project combines electromagnetic simulation with system-level analysis to derive guidelines for RF-interposer-enabled CPO architectures, contributing to scalable,