Substrate & Packaging Industrialization Expert

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Leoben; Vor Ort; EUR 70.000 - 95.000; Vollzeit

Benefits dieser Stelle

Long-term growth

International environment

Onboarding program

Continual training

Modern canteen

Free parking

E-charging stations

Employee benefits

Zusammenfassung

AT&S in Leoben, Austria seeks an Expert R&D – Substrate & Packaging Industrialization to evaluate integration approaches for high-precision components and translate concepts into stable processes in production environments.

The role requires a Bachelor’s or Master’s in Engineering or related field with 5+ years in substrate/PCB or advanced packaging, DoE experience, and fluency in English. You will work across R&D, prototyping, and production interfaces to enable scalable manufacturing.

Qualifikationen

• Bachelor’s or Master’s degree in Engineering, Materials Science, Electronics, or a related technical field.
• Several years (typically 5+ years) of experience in substrate, PCB, or advanced packaging manufacturing or process development environments.
• Experience across R&D, engineering, experimental work and DoE, and production interfaces in a collaborative environment.
• Experience in IC substrate manufacturing, HDI technologies, integration or prototyping is an advantage.
• Strong understanding of manufacturing and assembly processes in substrate or packaging environments.
• Ability to translate technical concepts into feasible and stable process solutions under real production conditions.
• Understanding of process sensitivities, tolerances, and material interactions in high-precision assemblies.
• Structured, hands‑on, and solution‑oriented way of working with a focus on implementation.
• Fluency in English.

Aufgaben

• Evaluate integration approaches for components requiring high-precision alignment within substrate and manufacturing environments.
• Assess compatibility of proposed approaches with existing process capabilities, materials, and infrastructure.
• Contribute to the development and realization of integration approaches within prototyping and process development activities.
• Identify process limitations, critical tolerances, and integration constraints affecting implementation.
• Support and execute experimental work, including design of experiments (DoE), to validate approaches under realistic conditions.
• Identify and understand process sensitivities and critical parameters affecting stability and yield.
• Iteratively refine processes based on experimental results and learnings.
• Contribute to the identification of required process adaptations, capability gaps, and infrastructure needs.
• Support internal decision‑making by providing feasibility assessments and technical input, participate in internal and external technical discussions related to process integration.
• Contribute to definition of implementation pathways for new technologies.

Kenntnisse

Substrate & PCB

Advanced packaging

HDI technologies

DoE (Design of Experiments)

Production interfaces

Material interactions

Engineering

Process optimization

Ausbildung

Bachelor's or Master's in Engineering / Materials Science / Electronics

Tools

DoE techniques

Jobbeschreibung

AT&S in Leoben, Austria seeks an Expert R&D – Substrate & Packaging Industrialization to evaluate integration approaches for high-precision components and translate concepts into stable processes in production environments.

The role requires a Bachelor’s or Master’s in Engineering or related field with 5+ years in substrate/PCB or advanced packaging, DoE experience, and fluency in English. You will work across R&D, prototyping, and production interfaces to enable scalable manufacturing.