Senior Expert - Substrate & Packaging Industrialization

oeh; Leoben; Vor Ort; EUR 90.000 - 120.000; Vollzeit

Benefits dieser Stelle

Long-term growth

Onboarding program

Modern canteen

Free parking

Health benefits

Zusammenfassung

AT&S Leoben is seeking a Senior Expert R&D in Substrate & Packaging Industrialization to advance integration concepts for high‑precision assemblies. You will translate concepts into stable processes through hands‑on experimentation.

Join an international team focusing on feasibility, prototyping, and scaling with DoE, collaboration across R&D and production, and a clear pathway for new technologies.

Qualifikationen

• Bachelor’s or Master’s degree in Engineering, Materials Science, Electronics or a related technical field.
• Five+ years experience in substrate, PCB or advanced packaging manufacturing or process development.
• Experience across R&D, engineering, DoE and production interfaces in a collaborative environment.
• Experience in IC substrate manufacturing, HDI technologies, integration or prototyping is an advantage.
• Strong understanding of manufacturing and assembly processes in substrate or packaging environments.
• Ability to translate technical concepts into feasible and stable process solutions under real production conditions.
• Understanding of process sensitivities and tolerances in high‑precision assemblies.
• Structured, hands‑on and solution‑oriented approach with implementation focus.
• Fluency in English.

Aufgaben

• Evaluate integration approaches for high‑precision alignment within substrate and manufacturing environments.
• Assess compatibility with existing process capabilities, materials, and infrastructure.
• Support prototyping and DoE in development of integration approaches.
• Identify process limitations, tolerances, and constraints affecting implementation.
• Support and execute DoE-based experiments to validate approaches under realistic conditions.
• Identify process sensitivities and critical parameters affecting stability and yield.
• Iteratively refine processes based on experimental results and learnings.
• Contribute to identification of required process adaptations and infrastructure needs.
• Support internal decision‑making with feasibility assessments and technical input on process integration.
• Contribute to defining implementation pathways for new technologies.

Kenntnisse

English

Substrate/PCB manufacturing

Design of experiments

Cross-functional collaboration

Ausbildung

Bachelor’s or Master’s degree in Engineering, Materials Science, Electronics

Jobbeschreibung

Leoben, AT

Jul 3, 2026

Be part of our team!

AT&S is a leading global manufacturer of high‑end IC substrates and printed circuit boards. AT&S industrializes leading‑edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high‑performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.

To enhance our successful R&D Team in Leoben, Austria, we are looking for a passionate

Senior Expert R&D – Substrate & Packaging Industrialization

In your role, you will be responsible for the evaluation and transfer of integration approaches for components requiring high‑precision alignment within substrate and packaging environments. The role focuses on assessing feasibility under realistic production conditions and contributes to the development and realization of integration approaches. The position contributes to building and validating integration processes through hands‑on experimental work and process development, ensuring that concepts can be translated into stable and scalable solutions.

Your responsibilities

• Evaluate integration approaches for components requiring high‑precision alignment within substrate and manufacturing environments
• Assess compatibility of proposed approaches with existing process capabilities, materials, and infrastructure
• Contribute to the development and realization of integration approaches within prototyping and process development activities
• Identify process limitations, critical tolerances, and integration constraints affecting implementation
• Support and execute experimental work, including design of experiments (DoE), to validate approaches under realistic conditions
• Identify and understand process sensitivities and critical parameters affecting stability and yield
• Iteratively refine processes based on experimental results and learnings
• Contribute to the identification of required process adaptations, capability gaps, and infrastructure needs
• Support internal decision‑making by providing feasibility assessments and technical input, participate in internal and external technical discussions related to process integration
• Contribute to definition of implementation pathways for new technologies

Your profile

• Bachelor’s or Master’s degree in Engineering, Materials Science, Electronics, or a related technical field
• Several years (typically 5+ years) of experience in substrate, PCB, or advanced packaging manufacturing or process development environments
• Experience working across R&D, engineering, experimental work and design of experiments (DoE), and production interfaces in a collaborative environment
• Experience in IC substrate manufacturing, HDI technologies, integration or prototyping is an advantage
• Strong understanding of manufacturing and assembly processes in substrate or packaging environments
• Ability to translate technical concepts into feasible and stable process solutions under real production conditions
• Understanding of process sensitivities, tolerances, and material interactions in high‑precision assemblies
• Structured, hands‑on, and solution‑oriented way of working with a focus on implementation
• Fluency in English

Our Offer

• A meaningful role with opportunities for long‑term growth in an international environment
• Chance to actively contribute to AT&S´ success and to create value
• A structured and tailor‑made onboarding program along with continual training opportunities
• Modern company canteen with freshly prepared meals every day
• Free parking spaces and e‑charging stations
• Diverse health measures and a wide range of employee benefits

Ready for a new challenge to advance your career? It´s just a click to apply online. We look forward to your application and your detailed resume. Your AT&S Team!

AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry, employment group H, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.