Expert - Substrate & Packaging Industrialization

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Leoben; Vor Ort; EUR 70.000 - 95.000; Vollzeit

Benefits dieser Stelle

Long-term growth

International environment

Onboarding program

Continual training

Modern canteen

Free parking

E-charging stations

Employee benefits

Zusammenfassung

AT&S in Leoben, Austria seeks an Expert R&D – Substrate & Packaging Industrialization to evaluate integration approaches for high-precision components and translate concepts into stable processes in production environments.

The role requires a Bachelor’s or Master’s in Engineering or related field with 5+ years in substrate/PCB or advanced packaging, DoE experience, and fluency in English. You will work across R&D, prototyping, and production interfaces to enable scalable manufacturing.

Qualifikationen

• Bachelor’s or Master’s degree in Engineering, Materials Science, Electronics, or a related technical field.
• Several years (typically 5+ years) of experience in substrate, PCB, or advanced packaging manufacturing or process development environments.
• Experience across R&D, engineering, experimental work and DoE, and production interfaces in a collaborative environment.
• Experience in IC substrate manufacturing, HDI technologies, integration or prototyping is an advantage.
• Strong understanding of manufacturing and assembly processes in substrate or packaging environments.
• Ability to translate technical concepts into feasible and stable process solutions under real production conditions.
• Understanding of process sensitivities, tolerances, and material interactions in high-precision assemblies.
• Structured, hands‑on, and solution‑oriented way of working with a focus on implementation.
• Fluency in English.

Aufgaben

• Evaluate integration approaches for components requiring high-precision alignment within substrate and manufacturing environments.
• Assess compatibility of proposed approaches with existing process capabilities, materials, and infrastructure.
• Contribute to the development and realization of integration approaches within prototyping and process development activities.
• Identify process limitations, critical tolerances, and integration constraints affecting implementation.
• Support and execute experimental work, including design of experiments (DoE), to validate approaches under realistic conditions.
• Identify and understand process sensitivities and critical parameters affecting stability and yield.
• Iteratively refine processes based on experimental results and learnings.
• Contribute to the identification of required process adaptations, capability gaps, and infrastructure needs.
• Support internal decision‑making by providing feasibility assessments and technical input, participate in internal and external technical discussions related to process integration.
• Contribute to definition of implementation pathways for new technologies.

Kenntnisse

Substrate & PCB

Advanced packaging

HDI technologies

DoE (Design of Experiments)

Production interfaces

Material interactions

Engineering

Process optimization

Ausbildung

Bachelor's or Master's in Engineering / Materials Science / Electronics

Tools

DoE techniques

Jobbeschreibung

Be part of our team!

AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.

To enhance our successful R&D Team in Leoben, Austria, we are looking for a passionate

Expert R&D – Substrate & Packaging Industrialization

In your role, you will be responsible for the evaluation and transfer of integration approaches for components requiring high-precision alignment within substrate and packaging environments. The role focuses on assessing feasibility under realistic production conditions and contributes to the development and realization of integration approaches. The position contributes to building and validating integration processes through hands‑on experimental work and process development, ensuring that concepts can be translated into stable and scalable solutions.

Your responsibilities

• Evaluate integration approaches for components requiring high-precision alignment within substrate and manufacturing environments
• Assess compatibility of proposed approaches with existing process capabilities, materials, and infrastructure
• Contribute to the development and realization of integration approaches within prototyping and process development activities
• Identify process limitations, critical tolerances, and integration constraints affecting implementation
• Support and execute experimental work, including design of experiments (DoE), to validate approaches under realistic conditions
• Identify and understand process sensitivities and critical parameters affecting stability and yield
• Iteratively refine processes based on experimental results and learnings
• Contribute to the identification of required process adaptations, capability gaps, and infrastructure needs
• Support internal decision‑making by providing feasibility assessments and technical input, participate in internal and external technical discussions related to process integration
• Contribute to definition of implementation pathways for new technologies

Your profile

• Bachelor’s or Master’s degree in Engineering, Materials Science, Electronics, or a related technical field
• Several years (typically 5+ years) of experience in substrate, PCB, or advanced packaging manufacturing or process development environments
• Experience working across R&D, engineering, experimental work and design of experiments (DoE), and production interfaces in a collaborative environment
• Experience in IC substrate manufacturing, HDI technologies, integration or prototyping is an advantage
• Strong understanding of manufacturing and assembly processes in substrate or packaging environments
• Ability to translate technical concepts into feasible and stable process solutions under real production conditions
• Understanding of process sensitivities, tolerances, and material interactions in high-precision assemblies
• Structured, hands‑on, and solution‑oriented way of working with a focus on implementation
• Fluency in English

Our Offer

• A meaningful role with opportunities for long-term growth in an international environment
• Chance to actively contribute to AT&S´ success and to create value
• A structured and tailor‑made onboarding program along with continual training opportunities
• Modern company canteen with freshly prepared meals every day
• Free parking spaces and e‑charging stations
• Diverse health measures and a wide range of employee benefits

AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry, employment group H, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.

Leoben, AT

Sep 28, 2026

18049