R&D Reliability Engineer - Glass Core Substrates

AT&S; Leoben; Vor Ort; EUR 65.000 - 90.000; Vollzeit

Benefits dieser Stelle

Modern canteen with meals

Free parking spaces

e-charging stations

Health measures and benefits

Structured onboarding and training

Zusammenfassung

AT&S in Leoben, Austria, seeks an Engineer R&D for Product and Process Reliability to develop and enhance glass core substrate technologies and ensure robust performance for advanced semiconductor applications.

You will work with suppliers and cross-functional teams to design, evaluate, and qualify packaging solutions, with focus on reliability and manufacturing excellence, in a role offering growth in an international environment.

Qualifikationen

• Bachelor’s or Master’s degree in materials science, mechanical engineering or electronics packaging.
• 3+ years in reliability engineering or packaging/substrate technology development.
• Expertise in thermo-mechanical reliability and failure analysis.
• Familiarity with JEDEC/IPC standards; stress simulation preferred.
• Strong collaboration and communication skills; English fluency.

Aufgaben

• Develop mechanical defect-free process for glass core substrate by working closely with materials suppliers.
• Lead the reliability design, evaluation, and qualification of glass core substrate, including TGV structure and coating configuration.
• Conduct reliability test plans covering thermal cycling, mechanical stress, warpage behavior, and electrical stability.
• Analyze failure mechanisms such as TGV cracking, SeWaRe, and CTE-mismatch effects.
• Manage cross-functional tasks and technical documentation.
• Analyze experimental data and provide input and recommendations to enhance product performance and improve process efficiency.

Kenntnisse

Reliability engineering

Materials reliability

Electronics packaging

Thermo-mechanical reliability

Stress simulation

Fluent English

Ausbildung

Bachelor’s/Master’s in materials science, mechanical engineering, electronics packaging, or related fields

Tools

JEDEC/IPC standards

Stress simulation (preferred)

Jobbeschreibung

AT&S in Leoben, Austria, seeks an Engineer R&D for Product and Process Reliability to develop and enhance glass core substrate technologies and ensure robust performance for advanced semiconductor applications.

You will work with suppliers and cross-functional teams to design, evaluate, and qualify packaging solutions, with focus on reliability and manufacturing excellence, in a role offering growth in an international environment.