Senior Engineer R&D - Patterning Process

At S; Leoben; In loco; EUR 85.000 - 115.000; Tempo pieno

Vantaggi offerti da questo lavoro

Long-term growth opportunities

Onboarding program

On-site canteen

Descrizione del lavoro

AT&S in Leoben, Austria, is seeking a Senior Engineer R&D - Patterning Process to develop circuit formation technologies for Glass Core Substrates and drive lithography/etching/plating process optimization. You will collaborate with material, equipment and reliability teams to ensure high quality patterning and manufacturability for next-generation interconnects.

Fluency in English and a strong background in materials or electrical engineering are required, with experience in microelectronic

Competenze

• Bachelor's or Master’s degree in Materials Science, Chemical Engineering, Electronics Engineering, Mechanical Engineering, or related fields.
• Several years of experience in microelectronic packaging, substrate, PCB, or process technology development.
• Expertise in lithography, etching, plating, and circuit formation processes.

Mansioni

• Develop circuit formation technologies for Glass Core Substrate by working closely with material, equipment, and process suppliers.
• Lead process development and optimization of lithography, etching, plating, and related technologies for high-density circuit patterning.
• Establish process windows to achieve target pattern quality, yield, and manufacturability while considering electrical and mechanical reliability requirements.
• Conduct process evaluations covering pattern quality, defect reduction, adhesion performance, dimensional stability, and electrical characteristics.
• Analyze failure mechanisms such as pattern defects, delamination, cracking, over/under etching, and process-induced reliability issues.
• Work closely with cross-functional teams including process, material and reliability engineering to drive technology development and project execution.

Conoscenze

Lithography

Etching

Plating

Patterning

Process integration

Reliability

English fluency

Formazione

Bachelor's or Master’s in Materials Science, Chemical Engineering, Electronics Engineering, Mechanical Engineering

Strumenti

Process equipment

Descrizione del lavoro

Leoben, AT

Oct 7, 2026

18190

Be part of our team!

AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.

R&D Glass Core PKG Team in Leoben, Austria

Senior Engineer R&D - Patterning Process

In your role

You will play a key role in developing advanced circuit formation technologies for next-generation Glass Core Substrates. Working closely with material, equipment, and process suppliers, you will drive the development and optimization of patterning processes that enable high-density interconnect solutions. You will contribute to innovative packaging technologies by ensuring high process performance, manufacturability, and reliability, while collaborating with multidisciplinary teams across R&D and engineering.

Your Responsibilities

• Develop circuit formation technologies for Glass Core Substrate by working closely with material, equipment, and process suppliers
• Lead process development and optimization of lithography, etching, plating, and related technologies for high-density circuit patterning
• Establish process windows to achieve target pattern quality, yield, and manufacturability while considering electrical and mechanical reliability requirements
• Conduct process evaluations covering pattern quality, defect reduction, adhesion performance, dimensional stability, and electrical characteristics
• Analyze failure mechanisms such as pattern defects, delamination, cracking, over/under etching, and process-induced reliability issues
• Work closely with cross-functional teams including process, material and reliability engineering to drive technology development and project execution

Your Profile

• Bachelor's/Master's degree in Materials Science, Chemical Engineering, Electronics Engineering, Mechanical Engineering, or related fields
• Several years of experience in microelectronic packaging, substrate, PCB, or process technology development
• Expertise in lithography, etching, plating, and circuit formation processes
• Understanding of process integration, defect analysis, yield improvement, and reliability considerations
• Familiarity with electrical and thermo-mechanical reliability requirements for substrate or packaging applications
• Strong responsibility-driven mindset for achieving development goals reliably and efficiently
• Fluency in English

Our Offer

• A meaningful role with opportunities for long-term growth in an international environment
• Chance to actively contribute to AT&S success and to create value
• A structured and tailor-made onboarding program along with continual training opportunities
• Modern company canteen with freshly prepared meals every day
• Free parking spaces and e-charging stations
• Diverse health measures and a wide range of employee benefits

AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry, employment group F-G, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.