Principal Engineer R&D - Build-up Process

At S; Leoben; On-site; EUR 90,000 - 120,000; Full time

Benefits offered by this job

Canteen and meals

Free parking

E-charging stations

Employee benefits

Job summary

AT&S Leoben sucht einen Principal Engineer R&D - Build-up Process, der die Weiterentwicklung von Build-up-Technologien für Glass Core Substrates steuert und die Integration von Prozessen vorantreibt. Sie arbeiten eng mit Partnern zusammen, gestalten Roadmaps und lösen komplexe technologische Herausforderungen.

Sie bringen Expertise in Dielectric Lamination, Via-Formation, Metallisierung, Lithografie, Ätzen und Beschichtung mit und leiten Entwicklungsprogramme sowie IP-Generierung und

Qualifications

• Bachelor's or Master's degree in Materials Science, Chemical/Mechanical/Electronics Eng or related field.
• Several years of experience in substrate/PCB/semiconductor packaging process development.
• Strong expertise in build-up process technologies: dielectric lamination, via formation, metallization, lithography, etching, plating.
• Experience in process integration for high-density interconnect and advanced substrate applications.
• Knowledge of glass handling, temporary carrier systems, defect control.
• Strong understanding of electrical and thermo-mechanical reliability requirements.
• Experience in process optimization, yield improvement, root cause analysis, reliability enhancement.
• Proven ability to lead complex technical projects and collaborate cross-functionally.
• Strong communication and problem-solving, ability to influence technical direction.
• Fluency in English.

Responsibilities

• Leading the development of build-up technologies for Glass Core Substrate applications.
• Developing and optimizing process technologies including glass handling, temporary support systems, dielectric lamination, via formation, metallization, lithography, etching, and plating.
• Establishing process integration strategies to achieve target electrical performance, mechanical reliability, yield, and manufacturability.
• Defining technology roadmaps for build-up structures, fine-line interconnects, and next-generation Glass Core Substrate architectures.
• Developing handling concepts and process solutions to minimize glass damage, warpage, cracking, and process-induced defects throughout manufacturing.
• Driving resolution of technical challenges related to material interactions, dimensional stability, process variation, and reliability performance.
• Leading root cause analysis and implementation of corrective actions for process and reliability issues.
• Collaborating closely with material suppliers, equipment vendors, and cross-functional teams to accelerate technology development and qualifications.
• Providing technical leadership for development programs, intellectual property generation, and technology transfer activities.

Skills

Build-up process

Dielectric lamination

Via formation

Metallization

Lithography

Etching

Plating

Process integration

Reliability

Leadership

English fluency

Education

Bachelor's or Master's degree

Job description

Leoben, AT

Oct 7, 2026

18189

Be part of our team!

AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.

To enhance our successful R&D Glass Core Team in Leoben, Austria, we are looking for a passionate

Principal Engineer R&D - Build-up Process

In your role you will take a role in developing next-generation build-up technologies for advanced Glass Core Substrate applications. You will drive innovation across process development and integration, enabling future high-performance semiconductor packaging solutions. Working closely with internal and external partners, you will shape technology roadmaps, solve complex technical challenges, and contribute to the successful industrialization of cutting-edge substrate technologies.

Your Responsibilities

• Leading the development of build-up technologies for Glass Core Substrate applications
• Developing and optimize process technologies including glass handling, temporary support systems, dielectric lamination, via formation, metallization, lithography, etching, and plating
• Establishing process integration strategies to achieve target electrical performance, mechanical reliability, yield, and manufacturability
• Defining technology roadmaps for build-up structures, fine-line interconnects, and next-generation Glass Core Substrate architectures
• Developing handling concepts and process solutions to minimize glass damage, warpage, cracking, and process-induced defects throughout manufacturing
• Driving resolution of technical challenges related to material interactions, dimensional stability, process variation, and reliability performance
• Leading root cause analysis and implementation of corrective actions for process and reliability issues
• Collaborating closely with material suppliers, equipment vendors, and cross-functional teams to accelerate technology development and qualifications
• Providing technical leadership for development programs, intellectual property generation, and technology transfer activities

Your Profile

• Bachelor's or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electronics Engineering, or a related field
• Several years of experience in substrate, PCB, semiconductor packaging, or related process technology development
• Strong expertise in build-up process technologies including dielectric lamination, via formation, metallization, lithography, etching, and plating
• Experience in process integration and technology development for high-density interconnect and advanced substrate applications
• Knowledge of glass handling, temporary carrier/support systems, thin substrate processing, and defect control methodologies
• Strong understanding of electrical and thermo-mechanical reliability requirements for advanced substrate technologies
• Experience in process optimization, yield improvement, root cause analysis, and reliability enhancement
• Proven ability to lead complex technical projects and drive cross-functional collaboration
• Strong communication and problem-solving skills with the ability to influence technical direction and development strategy
• Fluency in English

Our Offer

• A meaningful role with opportunities for long-term growth in an international environment
• Chance to actively contribute to AT&S´ success and to create value
• A structured and tailor-made onboarding program along with continual training opportunities
• Modern company canteen with freshly prepared meals every day
• Free parking spaces and e-charging stations
• Diverse health measures and a wide range of employee benefits

Ready for a new challenge to advance your career? It´s just a click to apply online. We look forward to your application and your detailed resume. Your AT&S Team!

AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths.The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry, employment group G, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.