Principal Engineer R&D - Build-up Process

Mental Health Group; Österreich; Remote; EUR 110.000 - 140.000; Vollzeit

Benefits dieser Stelle

Long-term growth

Onboarding program

Modern canteen

Free parking & charging

Health benefits

Diversity & inclusion

Zusammenfassung

AT&S Leoben is seeking a Principal Engineer R&D - Build-up Process to drive next-generation Glass Core Substrate technologies. You will lead development, optimize processes, and shape roadmaps with internal and external partners to industrialize high-performance packaging solutions.

Candidates have 10+ years in substrate or semiconductor packaging, strong expertise in dielectrics, vias, metallisation, lithography, and reliability, plus excellent leadership and English communication.

Qualifikationen

• Bachelor's or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electronics Engineering, or a related field.
• 10+ years of experience in substrate, PCB, semiconductor packaging, or related process technology development.
• Strong expertise in build-up process technologies including dielectric lamination, via formation, metallisation, lithography, etching, and plating.
• Experience in process integration and technology development for high-density interconnect and advanced substrate applications.
• Knowledge of glass handling, temporary carrier/support systems, thin substrate processing, and defect control methodologies.
• Strong understanding of electrical and thermo-mechanical reliability requirements for advanced substrate technologies.
• Experience in process optimisation, yield improvement, root cause analysis, and reliability enhancement.
• Proven ability to lead complex technical projects and drive cross-functional collaboration.
• Strong communication and problem-solving skills with the ability to influence technical direction and development strategy.
• Fluency in English

Aufgaben

• Lead development of build-up technologies for Glass Core Substrate applications.
• Develop and optimize process technologies including glass handling, temporary support systems, dielectric lamination, via formation, metallisation, lithography, etching, and plating.
• Establish integration strategies to meet electrical performance, reliability, yield, and manufacturability.
• Define technology roadmaps for build-up structures, fine‑line interconnects, and next‑generation Glass Core Substrate architectures.
• Develop handling concepts to minimise glass damage, warpage, cracking, and defects.
• Drive root cause analysis and corrective actions for process and reliability issues.
• Collaborate with material suppliers, equipment vendors, and cross‑functional teams to accelerate technology development and qualifications.
• Provide technical leadership for development programmes, intellectual property generation, and technology transfer activities.

Kenntnisse

Leadership

Communication

Problem-solving

Fluency in English

Ausbildung

Bachelor's or Master's in Materials Science/Engineering

Jobbeschreibung

Leoben, AT

Be part of our team!

AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.

To enhance our successful R&D Glass CoreTeam in Leoben, Austria, we are looking for a passionate

Principal Engineer R&D - Build-up Process

In your role you will take a role in developing next-generation build-up technologies for advanced Glass Core Substrate applications. You will drive innovation across process development and integration, enabling future high-performance semiconductor packaging solutions. Working closely with internal and external partners, you will shape technology roadmaps, solve complex technical challenges, and contribute to the successful industrialization of cutting-edge substrate technologies.

Your Responsibilities

• Leading the development of build-up technologies for Glass Core Substrate applications
• Developing and optimise process technologies including glass handling, temporary support systems, dielectric lamination, via formation, metallisation, lithography, etching, and plating
• Establishing process integration strategies to achieve target electrical performance, mechanical reliability, yield, and manufacturability
• Defining technology roadmaps for build-up structures, fine‑line interconnects, and next‑generation Glass Core Substrate architectures
• Developing handling concepts and process solutions to minimise glass damage, warpage, cracking, and process‑induced defects throughout manufacturing
• Driving resolution of technical challenges related to material interactions, dimensional stability, process variation, and reliability performance
• Leading root cause analysis and implementation of corrective actions for process and reliability issues
• Collaborating closely with material suppliers, equipment vendors, and cross‑functional teams to accelerate technology development and qualifications
• Providing technical leadership for development programmes, intellectual property generation, and technology transfer activities

Your Profile

• Bachelor's or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electronics Engineering, or a related field
• 10+ years of experience in substrate, PCB, semiconductor packaging, or related process technology development
• Strong expertise in build‑up process technologies including dielectric lamination, via formation, metallisation, lithography, etching, and plating
• Experience in process integration and technology development for high‑density interconnect and advanced substrate applications
• Knowledge of glass handling, temporary carrier/support systems, thin substrate processing, and defect control methodologies
• Strong understanding of electrical and thermo‑mechanical reliability requirements for advanced substrate technologies
• Experience in process optimisation, yield improvement, root cause analysis, and reliability enhancement
• Proven ability to lead complex technical projects and drive cross‑functional collaboration
• Strong communication and problem‑solving skills with the ability to influence technical direction and development strategy
• Fluency in English

Our Offer

• A meaningful role with opportunities for long‑term growth in an international environment
• Chance to actively contribute to AT&S´ success and to create value
• A structured and tailor‑made onboarding programme along with continual training opportunities
• Modern company canteen with freshly prepared meals every day
• Free parking spaces and e‑charging stations
• Diverse health measures and a wide range of employee benefits

AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry, employment group G, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.