Lead Mechanical Engineer, Fluid Systems (Hybrid)

Lam Research Corporation; Salzburg; Hybrid; EUR 42,000 - 66,000; Full time

Job summary

Lam Research Corporation is seeking a Mechanical Engineer to design and define cutting-edge mechanical and electro‑mechanical systems for semiconductor processing equipment. You will conduct feasibility studies, run tests, and guide cross‑functional teams through detailed design and fabrication to shape packaging and integration.

The role requires hands‑on experience with 3D CAD tools, strong communication, and the ability to lead projects.

Qualifications

• Minimum qualifications: Bachelor's degree in Mechanical Engineering or related field with 5+ years of experience; or Master's degree with 3+ years; or equivalent experience.
• Excellent communication, both written and verbal, and technical presentation skills.
• Highly proficient in 3D CAD tools such as CREO, Siemens NX, ProE, SolidWorks, and others.

Responsibilities

• Lead fluidic and mechanical system development from concept through productization, including design, prototyping and validation
• Design and integrate gas and liquid delivery systems, selecting appropriate components for high‑purity and process‑critical applications
• Develop P&IDs, schematics, and layouts to ensure manufacturable system integration
• Perform engineering analyses (flow, pressure, thermal, structural) and execute testing to optimize system performance and robustness
• Generate technical documentation, FMEA and specifications to deliver safe, manufacturable and cost‑effective solutions
• Collaborate with suppliers and cross‑functional teams while providing technical leadership and mentorship in fluid system design

Skills

Strong communication

Technical presentation

Project leadership

Education

Bachelor's degree in Mechanical Engineering

Master's degree in Mechanical Engineering

Tools

CREO

Siemens NX

ProE

SolidWorks

Job description

Lam Research Corporation is seeking a Mechanical Engineer to design and define cutting-edge mechanical and electro‑mechanical systems for semiconductor processing equipment. You will conduct feasibility studies, run tests, and guide cross‑functional teams through detailed design and fabrication to shape packaging and integration.

The role requires hands‑on experience with 3D CAD tools, strong communication, and the ability to lead projects.