Hands-on Embedded Firmware Lead - Remote US

Flexhire; Buenos Aires; Remote; ARS 212,224,000 - 303,177,000; Full time

Benefits offered by this job

Meaningful equity

Full medical, dental, and vision

Remote US with travel to Asia

Job summary

Flexhire is seeking a hands-on Firmware Engineering Lead to own end-to-end firmware development for a next-generation platform. You'll work on development hardware in the US, coordinate with the Shenzhen team, and design a continuous around-the-clock engineering workflow across time zones.

You'll lead kernel-level and user-level drivers, BSP and AOSP bring-up, and work with ODM and silicon partners in Taiwan/China. Regular travel to China and Taiwan (~25–30%) is expected.

Qualifications

• Hands-on firmware engineer with production code writing daily.
• Deep Qualcomm platform expertise including BSP bring-up and AOSP.
• Strong RTOS experience and ability to lead across time zones.

Responsibilities

• Design firmware architectures and lead device bring-up sprints.
• Own around-the-clock firmware development across US and Shenzhen.
• Interface with ODM and silicon partners to keep hardware delivery on schedule.
• Travel to China and Taiwan ~25–30%.

Skills

Firmware engineering

RTOS

AOSP

Linux kernel

Device tree

BSP bring-up

HAL layer

Driver development

ODM management

NPI

Hardware bring-up

Cross-time-zone leadership

Job description

Flexhire is seeking a hands-on Firmware Engineering Lead to own end-to-end firmware development for a next-generation platform. You'll work on development hardware in the US, coordinate with the Shenzhen team, and design a continuous around-the-clock engineering workflow across time zones.

You'll lead kernel-level and user-level drivers, BSP and AOSP bring-up, and work with ODM and silicon partners in Taiwan/China. Regular travel to China and Taiwan (~25–30%) is expected.