Yield Engineer I — Drive IC Process Improvements

Microchip Technology Inc; Colorado Springs (CO); On-site; USD 70,000 - 110,000; Full time

Job summary

Microchip Technology Inc. in the United States is seeking a wafer fab device engineer to own yield responsibility, improve product yields, and support new product introductions. You will work with multiple engineering teams to drive experiments and analyze data for reliability improvements.

The role involves first-shift work, collaboration across process and test groups, and frequent interaction with management to align on yield targets and project plans.

Qualifications

• Knowledge of basic semiconductor device physics and electronics, including transistor characteristics.
• Understanding of basic digital and analog circuits, their components and how they are characterized.
• Overall knowledge of the integrated circuit wafer fab manufacturing process.
• Familiarity with test equipment such as semiconductor parameter analyzers, power supplies, multimeters, generators, oscilloscopes, curve tracers, etc.
• Knowledge of basic statistical functions and SPC, including concept of normal distributions and Cpk's, analysis of variance, and correlation techniques.
• Ability to effectively present information to management and employees, both written and orally.
• Understanding of mathematical concepts such as probability, fundamentals of geometry, algebra, trigonometry, and calculus.
• Ability to effectively solve problems and help drive improvement activities. Will need to define problems/issues, collect data, establish facts, and draw valid conclusions.

Responsibilities

• Works closely with wafer fab process engineering, product engineering, design engineering, and test engineering to understand issues/opportunities and drive yield improvement activities.
• Analyzes production and engineering data to identify and resolve product yield issues.
• Designs, coordinates, and analyzes IC manufacturing process experiments to improve product yields and performance.
• Evaluates the parametric and product impact of process experiments.
• Uses evaluation equipment such as manual probe stations, parametric evaluation equipment, bit mappers, and microscopes to collect engineering data, perform failure analysis, and detect circuit and/or fabrication problems causing failures.
• Dispositions maverick material at parametric test and wafer sort.
• Owns responsibility for product/technology including maintenance of yield limits, process change control, new product introduction and yield improvements.
• Supports the introduction of new products and process flows into the fab and parametric test area through the creation, review, and implementation of necessary supporting specifications and process routes and flows. This may involve supporting transfers from other facilities.
• Plans and completes various technical projects.
• Communicates regularly with management and other functional groups within Microchip to ensure understanding of needs/problems in relation to the Yield Engineering function.

Skills

Semiconductor device physics

Digital & analog circuits

IC wafer fab process

Test equipment knowledge

Statistics & SPC

Communication skills

Mathematics (calc, geometry)

Problem solving

Education

BSEE +5 years

MSEE +2 years

Tools

Parameter analyzers

Power supplies

Multimeters

Generators

Oscilloscopes

Curve tracers

Job description

Microchip Technology Inc. in the United States is seeking a wafer fab device engineer to own yield responsibility, improve product yields, and support new product introductions. You will work with multiple engineering teams to drive experiments and analyze data for reliability improvements.

The role involves first-shift work, collaboration across process and test groups, and frequent interaction with management to align on yield targets and project plans.