XPU Business Development Leader

TYLsemi; United States; Remote; USD 175.000 - 300.000; Vollzeit

Zusammenfassung

TYLsemi in the United States seeks a senior business development leader to own customer and ecosystem development for its AI infrastructure product portfolio. You will identify target accounts, engage hyperscalers and custom silicon builders, and translate platform requirements into product inputs for R&D.

You will manage NDA pipelines, drive industry standards participation, and build relationships with IP vendors, OSATs, and foundry programs.

Qualifikationen

• 10+ years in business development, FAE, or product management in semiconductors.
• Established relationships with hyperscalers, AI chip startups, or custom ASIC customers.
• FAE or CPM background preferred for engaging R&D and platform teams on chiplet topics.
• Experience with ecosystem partners like IP vendors, OSAT, or packaging partners.
• Proven track record of moving deals from first contact to signed agreement in long-cycle semiconductor sales.
• Willingness to travel within US.

Aufgaben

• Identify, qualify, and develop strategic accounts — hyperscalers, AI compute companies, and infrastructure semiconductor customers — from first contact through proposals and commercial agreement.
• Engage customer architecture, platform, and procurement teams at the technical level; translate AI chip and chiplet platform requirements into actionable product specs for R&D.
• Own the ecosystem partner map — IP vendors, OSATs, packaging partners, and foundry ecosystem programs; establish and maintain working relationships that support product and tape-out execution.
• Drive participation in industry standards bodies and chiplet consortia to build visibility and influence roadmap alignment.
• Develop and manage NDA pipeline, customer evaluation programs, and early-access engagements in coordination with engineering.
• Produce and maintain account plans, pipeline tracking, and BD status reporting for leadership.
• Represent TylSemi at industry events, customer briefings, and technical forums.

Kenntnisse

Business development

FAE

Product management

Semiconductors

Chiplet experience

UCIe knowledge

PCIe knowledge

Power delivery topics

Jobbeschreibung

Role

Own customer and ecosystem development for TylSemi’s product portfolio. You will identify and qualify target accounts in AI infrastructure market, engage architecture and procurement teams at hyperscalers and custom silicon builders, and translate customer platform requirements into product and roadmap inputs for R&D. You will also develop and manage relationships across the ecosystem — IP partners, OSATs, foundry ecosystem programs, and industry consortia.

Responsibilities

• Identify, qualify, and develop strategic accounts — hyperscalers, AI compute companies, and infrastructure semiconductor customers — from first contact through proposals and commercial agreement
• Engage customer architecture, platform, and procurement teams at the technical level; translate AI chip and chiplet platform requirements into actionable product specs for R&D
• Own the ecosystem partner map — IP vendors, OSATs, packaging partners, and foundry ecosystem programs; establish and maintain working relationships that support product and tape-out execution
• Drive participation in industry standards bodies and chiplet consortia (UCIe Consortium, PCI-SIG, CXL Consortium, OCP, IEEE, JEDEC etc.) to build visibility and influence roadmap alignment
• Develop and manage NDA pipeline, customer evaluation programs, and early-access engagements in coordination with engineering
• Produce and maintain account plans, pipeline tracking, and BD status reporting for leadership
• Represent TylSemi at industry events, customer briefings, and technical forums

Qualifications

• 10+ years in business development, FAE, or customer/product management roles in semiconductors, with direct exposure to advanced AI chips, accelerators, or chiplet-based silicon
• Established relationships across hyperscaler silicon teams, AI chip startups, or custom ASIC customers; able to open doors at the architecture level, not just procurement
• FAE or CPM background strongly preferred — technical depth to engage R&D and platform teams credibly on chiplet integration, UCIe, PCIe, or power delivery topics
• Experience working the ecosystem side: IP vendors, foundry BD programs, OSAT, or packaging partners
• Track record of moving deals from first contact to signed agreement in a technical, long-cycle semiconductor sales environment
• Comfortable operating without a large support structure — this role owns its own pipeline, materials, and follow-through
• US-based; ability to travel for customer and industry engagements

The pay range for this role is: 175,000 - 300,000 USD per year