Wirebond Process Technician — Flexible Schedule & Growth

Leonardo DRS; Dallas (TX); On-site; USD 50,000 - 70,000; Full time

Benefits offered by this job

Medical insurance

Dental coverage

Vision coverage

401(k)

Job summary

Leonardo DRS is seeking a Process Technician - Wirebond in Dallas, TX to support wire bonding of focal plane arrays. Responsibilities include handling parts, chemical handling, inspection, and assembly, with adherence to safety and quality standards.

A clean room environment and strong documentation skills are emphasized. Required is a High School diploma and 2+ years in wire‑bonding or related semiconductor processing.

Qualifications

• High School diploma is required.
• 2+ years of technical experience in wire-bonding or semiconductor processing or material handling.

Responsibilities

• Provide technical support to engineers and scientists on moderately complex components, devices, materials, products, processes and/or equipment.
• Responsible for testing, modifying, reworking, and repairing electronic, optical and mechanical assemblies.
• Work from moderately complex wiring and assembly drawings, operation sheets, engineering specifications and sketches.
• Design and test prototype assemblies and production units.
• Use judgment in re‑working or re‑wiring to bring unit within quality control specifications.
• Test, inspect, and repair electronic, optical or mechanical assemblies.
• Work under minimal supervision and may provide guidance to other technicians.
• Interface with other departments to assure efficient flow of information and materials.

Skills

Manual dexterity

Attention to detail

Good communication

Self‑direction

Clean room experience

Education

High School diploma

Job description

Leonardo DRS is seeking a Process Technician - Wirebond in Dallas, TX to support wire bonding of focal plane arrays. Responsibilities include handling parts, chemical handling, inspection, and assembly, with adherence to safety and quality standards.

A clean room environment and strong documentation skills are emphasized. Required is a High School diploma and 2+ years in wire‑bonding or related semiconductor processing.