Wafer Fab Technician – Photolithography & Wet Etch

Semtech; California; On-site; USD 34,000 - 50,000; Full time

Job summary

Semtech is seeking a Wafer Fab Process Technician in Rowland, CA, to run high‑volume production for InP BH DFB lasers and BH GC devices. The role emphasizes photolithography, wet etch, and MOCVD support in a cleanroom environment.

You will lead process control, device qualification, and troubleshooting while mentoring junior technicians to maintain throughput targets and yield performance.

Qualifications

• Associate degree or equivalent experience in electronics, chemistry, materials science, or related field.
• 5–10 years in semiconductor/photonics wafer processing with III‑V/InP experience.
• Hands‑on photolithography track systems and steppers/scanners in high‑volume production.
• Wet etch and wet bench experience on III‑V materials (InP, InGaAsP).
• Strong knowledge of photolithography, CD/overlay control, wet etch, and inline fab steps.
• Proficiency with litho/metrology tools (CD‑SEM, overlay, defect inspection, profilometry).
• Knowledge of wet etch chemistries and etch profile control for III‑V materials.

Responsibilities

• Operate photolithography module to keep InP BH DFB laser and BH GC wafer lots moving on schedule.
• Monitor litho track systems and steppers/scanners; maintain CD, overlay, and film thickness within spec.
• Perform wet etch steps (stripe etch, Mesa etch) supporting MOCVD regrowth of InP layers.
• Manage wet bench operations and maintain chemistry, bath changes, and etch‑rate monitors.
• Prioritize lots in litho and wet etch bays to sustain tool utilization and throughput.
• Troubleshoot litho, wet bench, and process issues to minimize downtime.
• Lead root‑cause investigations and collaborate with Process Engineering on fixes.
• Own SPC charts for photolithography CD/overlay and wet etch metrics.
• Maintain recipes and POR documentation; verify stability after changes.
• Support DOEs, qualifications, and train junior staff.

Skills

Photolithography

Wet etch

InP processing

CD‑SEM

Overlay control

Education

Associate degree in electronics, chemistry, materials science, or related technical field preferred; equivalent experience considered

Tools

Steppers/Scanners

Profilometry

Wet bench equipment

MOCVD system

Job description

Position Summary The Wafer Fab Process Technician serves as a key production and technical leader whose primary responsibility is running volume production in support of daily wafer fabrication schedules, while also ensuring process stability, recipe control, and yield performance across InP photonic device lines, specifically InP Buried Heterostructure (BH) DFB lasers and BH Gain Chips (GC). The majority of this role’s hands‑on time is spent operating the photolithography module (coat/develop track systems, steppers/scanners, and associated litho metrology) to keep volume production lots moving on schedule, with additional ownership of wet etch steps, including stripe and Mesa etch, supporting MOCVD epitaxial regrowth of InP current‑blocking layers used to form the buried heterostructure.

Location: Rowland, CA (Onsite)

Position Summary

The Wafer Fab Process Technician serves as a key production and technical leader whose primary responsibility is running volume production in support of daily wafer fabrication schedules, while also ensuring process stability, recipe control, and yield performance across InP photonic device lines, specifically InP Buried Heterostructure (BH) DFB lasers and BH Gain Chips (GC). The majority of this role’s hands‑on time is spent operating the photolithography module (coat/develop track systems, steppers/scanners, and associated litho metrology) to keep volume production lots moving on schedule, with additional ownership of wet etch steps, including stripe and Mesa etch, supporting MOCVD epitaxial regrowth of InP current‑blocking layers used to form the buried heterostructure. Operating with minimal supervision in a III‑V cleanroom environment, the Technician plays a vital role in meeting fab throughput targets, leading root‑cause investigations for process excursions, maintaining strict Process‑of‑Record (POR) discipline, and mentoring junior technicians and operators to support reliable, high‑yield, high‑volume manufacturing.

Responsibilities

Photolithography & Wet Etch Production Operations (50%):

• Serve as the primary production technician for the photolithography module, executing coat, expose/align, develop, and descum process steps to keep InP BH DFB laser and BH GC wafer lots moving through volume production on schedule
• Operate and monitor litho track (coat/develop) systems and steppers/scanners, maintaining critical dimension (CD), overlay, and film thickness within specification for every lot
• Execute wet etch steps, including stripe etch and Mesa etch, that directly support MOCVD epitaxial regrowth of InP current‑blocking layers for buried heterostructure formation; control etch time, temperature, and chemistry to hold mesa profile, undercut, and etch depth targets
• Perform wet bench operations including dielectric mask removal, resist strip, and pre‑regrowth surface cleans, and maintain wet bench chemistry through scheduled bath changes, concentration checks, and etch‑rate monitors
• Prioritize and sequence hot lots, engineering wafers, and standard production lots in the litho and wet etch bays to sustain high tool utilization and meet daily/weekly throughput targets
• Perform in‑line CD, overlay, etch depth, and defect inspection and first‑wafer/first‑lot qualification checks prior to releasing lots downstream
• Troubleshoot routine litho tool, wet bench, and process issues in real time to minimize downtime and protect production schedule adherence

Advanced Process Troubleshooting & Root Cause (20%):

• Lead root‑cause investigation for process excursions and drift across assigned process modules (e.g., litho CD shift, resist adhesion or defectivity, wet etch rate drift, mesa profile or undercut variation)
• Design and run targeted process checks (short‑loop wafers, engineering splits) to isolate root cause
• Partner with Process Engineering on corrective action design and verification

Process Control & SPC Ownership (20%):

• Own SPC control charts and control‑limit reviews for assigned process area, including photolithography CD, overlay, and wet etch rate and depth metrics
• Own and maintain process recipes and POR documentation for assigned process area, with emphasis on photolithography track and expose recipes and wet etch procedures
• Evaluate and implement engineering‑approved recipe changes; verify post‑change process stability
• Support qualification of new or modified process steps

DOE, Qualification & Training Support (10%):

• Support execution of DOEs, process qualifications, and NPI process runs
• Train and mentor Operators on photolithography and wet etch production operation, chemical handling, process control methods, and troubleshooting technique

Minimum Qualifications

• Associate degree in electronics, chemistry, materials science, or related technical field preferred; equivalent experience considered
• 5 - 10 years of experience in semiconductor/photonics wafer processing, with direct III‑V/InP process experience
• Direct, hands‑on experience operating photolithography track systems and steppers/scanners in a high‑volume production environment strongly preferred
• Hands‑on wet etch and wet bench experience on III‑V materials (e.g., InP, InGaAsP) preferred
• Strong working knowledge of photolithography (coat/develop track, expose/align, CD and overlay control), wet etch, and in‑line fab process steps
• Hands‑on proficiency operating litho and metrology tools (CD‑SEM, overlay, defect inspection, profilometry) in a volume production setting
• Working knowledge of wet etch chemistries, selectivity, and etch profile control for III‑V semiconductors and dielectric masks
• Ability to independently lead complex processes of troubleshooting and root‑cause investigations
• Demonstrated ability to sustain lot throughput and cycle‑time targets in a high‑volume photolithography production bay
• Strong ownership mentality and independent judgment
• Effective communication with operators, technicians, and process engineers
• Ability to mentor and train junior staff
• Ability to work in a cleanroom environment for extended periods across multiple process bays, including sustained time in the photolithography bay to support volume production pace
• Ability to work around chemicals (acids, solvents) with proper safety procedures
• May require flexibility to support engineering runs or excursions outside standard shift hours

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job‑related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

A reasonable estimate of the pay range for this position is $25 – $36. There are several factors taken into consideration in determining base salary, including but not limited to: job‑related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.