Wafer Fab Technician - Metallization, Dry Etch & Wet Etch

semtech; California; On-site; USD 65,000 - 95,000; Full time

Job summary

Semtech in Rowland, CA is seeking a Wafer Fab Process Technician to run volume production for InP BH DFB lasers and BH GC devices in an onsite III-V cleanroom. You will operate metallization, e-beam evaporation, sputtering, lift-off, and etch steps to maintain schedules and yield.

You will lead root-cause investigations, maintain POR discipline, and mentor junior technicians to ensure high-throughput, high-yield manufacturing.

Qualifications

• Experience in semiconductor/photonics wafer processing, especially III-V/InP.
• Hands-on operation of e-beam evaporation or sputter deposition in high-volume fab.
• Experience with dry and wet etch on III-V materials and dielectrics.
• Strong metallization and contact alloy knowledge.

Responsibilities

• Lead metallization, dry etch, and wet bench operations to keep InP BH DFB laser and BH GC lots on schedule.
• Operate deposition systems to achieve correct metal stacks, thickness, and uniformity.
• Perform lift-off, metal etch, and post-metal surface cleaning, including annealing for ohmic contact alloy.
• Troubleshoot metallization and etch tools to minimize downtime and protect production schedule.

Skills

Wafer processing

III-V/InP processes

Metallization

Process troubleshooting

SPC control

Education

Associate degree or equivalent

Tools

E-beam evaporation

Sputter deposition

Lift-off processing

RIE/ICP etching

Job description

Position Summary

Location: Rowland, CA (Onsite)

The Wafer Fab Process Technician serves as a key production and technical leader whose primary responsibility is running volume production in support of daily wafer fabrication schedules, while also ensuring process stability, recipe control, and yield performance across InP photonic device lines, specifically InP Buried Heterostructure (BH) DFB lasers and BH Gain Chips (GC). The majority of this role's hands-on time is spent operating the metallization module (e-beam evaporation and/or sputter deposition systems, lift-off processing, and contact alloy) to keep volume production lots moving on schedule, with additional ownership of dry etch and wet etch steps, including contact opening and surface preparation, that support formation of low-resistance p- and n-type ohmic contacts on finished buried heterostructure devices.

Operating with minimal supervision in a III-V cleanroom environment, the Technician plays a vital role in meeting fab throughput targets, leading root-cause investigations for process excursions, maintaining strict Process-of-Record (POR) discipline, and mentoring junior technicians and operators to support reliable, high-yield, high-volume manufacturing.

Responsibilities

• Metallization, Dry Etch & Wet Etch Production Operations (50%): Serve as the primary production technician for the metallization module, keeping InP BH DFB laser and BH GC wafer lots moving through volume production on schedule
  Operate e-beam evaporation and/or sputter deposition systems to deposit p- and n-contact metal stacks (e.g., Ti/Pt/Au and Au-based n-contact metals), maintaining film thickness, deposition rate, and uniformity within specification for every lot
  Execute lift-off, metal etch, and solvent resist strip processes, and operate rapid thermal anneal (RTA) or furnace systems for ohmic contact alloy, maintaining metal adhesion, edge definition, and contact quality
  Operate ICP/RIE and plasma descum/ash systems for contact window opening in dielectric layers and resist residue removal ahead of metal deposition
  Execute wet etch and wet bench steps, including BOE oxide removal and pre-metal surface cleans, and maintain bench chemistry through scheduled bath changes and concentration checks
  Perform source loading, crucible and target management, chamber pump-down, and scheduled preventive maintenance tasks on deposition tools, and qualify tools with monitor wafers prior to returning them to production
  Prioritize and sequence hot lots, engineering wafers, and standard production lots across the metallization and etch bays to sustain high tool utilization and meet daily/weekly throughput targets
  Perform in-line metal thickness, sheet resistance, contact resistance (TLM), adhesion, and defect inspection and first-wafer/first-lot qualification checks prior to releasing lots downstream
  Troubleshoot routine metallization, dry etch, and wet bench tool and process issues in real time to minimize downtime and protect production schedule adherence
• Advanced Process Troubleshooting & Root Cause (20%): Lead root-cause investigation for process excursions and drift across assigned process modules (e.g., metal thickness non-uniformity, contact resistance shift, lift-off defects, adhesion failures, dry etch rate drift)
  Design and run targeted process checks (short-loop wafers, engineering splits) to isolate root cause
  Partner with Process Engineering and Equipment Engineering on corrective action design and verification
• Process Control & SPC Ownership (20%): Own SPC control charts and control-limit reviews for assigned process area, including metal thickness, sheet resistance, contact resistance, and dry/wet etch rate and depth metrics
  Own and maintain process recipes and POR documentation for assigned process area, with emphasis on metal deposition, lift-off, and contact alloy recipes
  Evaluate and implement engineering-approved recipe changes; verify post-change process stability
  Support qualification of new or modified process steps, including new metal stacks and source or target changes
• DOE, Qualification & Training Support (10%): Support execution of DOEs, process qualifications, and NPI process runs
  Train and mentor Operators on metallization, dry etch, and wet etch production operation, precious metal handling, process control methods, and troubleshooting technique

Minimum Qualifications

• Associate degree in electronics, chemistry, materials science, or related technical field preferred; equivalent experience considered
• 5 - 10 years of experience in semiconductor/photonics wafer processing, with direct III-V/InP process experience
• Direct, hands-on experience operating e-beam evaporation and/or sputter deposition systems in a high-volume production environment strongly preferred
• Hands-on dry etch and wet etch/wet bench experience on III-V materials and dielectrics preferred
• Strong working knowledge of metallization (e-beam evaporation, sputtering, lift-off, contact a