Wafer Dicing Technician

Teledyne Technologies Incorporated; Camarillo (CA); On-site; USD 52,000 - 69,000; Full time

Benefits offered by this job

Competitive salary

Health coverage from Day 1

PTO & holidays

401(k) match

Employee stock plan

Tuition reimbursement

Employee events

Job summary

Teledyne Imaging Sensors is seeking a Wafer Dicing Technician to join our mission-focused team. You will support daily wafer dicing operations, coordinate with engineers on quality control, and ensure accurate data recording through MES.

The role requires working second or split shifts, strong mechanical drawing skills, and proficiency with metrology tools and digital microscopy. A high school diploma plus relevant experience is required, with citizenship due to access restrictions.

Qualifications

• Ability to work second shift or split shift.
• Strong understanding of mechanical drawings on dimensions and tolerances.
• Proficiency with digital microscope and metrology tools.
• Proficiency with Microsoft Word, PowerPoint, and Excel.
• Manual dexterity to handle small, precision components.
• High School Diploma with 3 years of relevant experience.
• U.S. citizenship due to access restrictions.

Responsibilities

• Support daily wafer dicing operation including container labels, wafer mounting, saw dicing, demounting, cleaning, measuring and inspection duties.
• Collaborate with engineers on dicing operation for quality control, process control and continuous improvements.
• Document and report any nonconforming events and assist root cause analysis.
• Work with MES for process execution, data recording and reporting.
• Follow all laboratory protocols and safety procedures.
• Assist with maintaining equipment to ensure optimal operation and proper calibration.

Skills

Second shift capability

Mechanical drawings

MS Office proficiency

Manual dexterity

US citizenship

Education

High School Diploma + 3 years experience

Tools

MES

Digital microscope

Metrology tools

Job description

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Join Teledyne Imaging Sensors as a Wafer Dicing Technician!

Are you ready to launch your career to the next level? Join our mission-focused team, where we value technical excellence, collaboration, and agility. We’re the world’s leading provider of infrared sensors for space, with customers like NASA, ESA, and the US Department of Defense.

What You’ll Do:

• Support daily wafer dicing operation that includes container labels, wafer mounting, saw dicing, demounting, cleaning, measuring and inspection duties.

• Work with responsible engineers in dicing operation for quality control, process control and continuous improvements in dicing processes and procedures.

• Document and report any nonconformal event and assist root cause analysis.

• Work with Manufacturing Execution System (MES) for process execution, data recording and reporting.

• Follow all laboratory protocols and safety procedures.

• Assist with maintaining equipment to ensure optimal operation and proper calibration.

What You Need:

• Ability to work second shift or split shift.

• Strong understanding of mechanical drawings on dimensions and tolerances.

• Ability to use digital microscope and metrology tools.

• Proficiency with Microsoft Word, PowerPoint, and Excel.

• Manual dexterity to handle small, precision components.

• High School Diploma with 3 years of relevant experience.

• U.S. citizenship due to access restrictions.

What We Offer:

• Competitive Salary & Benefits Package

• Health, Dental, Vision, and Life Insurance from Day 1

• Paid Vacation, Sick Time, and Holidays

• 401(k) with Company Match

• Employee Stock Purchase Plan

• Educational Tuition Reimbursement

• Fun Employee Events throughout the year

Why Teledyne? Our infrared sensors are “Everywhere You Look”™ – from the James Webb Space Telescope to climate change studies. Join us and make a difference!

#TS&I

Salary Range:

$51,600.00-$68,800.000

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.