Vice President of Engineering

Davalyn Corporation; Denver (CO); On-site; USD 150,000 - 225,000; Full time

Benefits offered by this job

Medical, dental, and vision insurance

Disability and life insurance

Paid holidays and PTO

Flexible Spending Account

401(k) with company match

Job summary

Davalyn Corporation is seeking a Vice President of Engineering to lead development and commercialization of advanced semiconductor capital equipment and wafer-processing systems. This senior executive will drive architecture, product strategy, and disciplined execution across mechanical, electrical, controls, software, systems, and reliability engineering.

The VP will oversee New Product Introduction, verification and validation, manufacturing readiness, lifecycle support, and supplier and

Qualifications

• 15+ years of progressive engineering experience with significant leadership responsibilities.
• Experience leading complete capital-equipment platforms or major product families.
• Leadership of multidisciplinary engineering teams across multiple functions.
• Experience taking complex equipment through product development, integration, qualification, NPI, and manufacturing transfer.
• Strong knowledge of product reliability, V&V, configuration control, ECR, root-cause analysis, FMEA.
• Experience developing equipment for demanding semiconductor fab or advanced manufacturing environments.
• Bachelor's degree in an engineering discipline; advanced degree is a plus.

Responsibilities

• Lead a multidisciplinary engineering org for semiconductor capital equipment and wafer-processing platforms.
• Set engineering priorities and roadmaps aligning with tech strategy and customer requirements.
• Provide leadership across mechanical, electrical, controls, software, systems, process, and reliability engineering.
• Guide new equipment programs from definition through production introduction and deployment.
• Drive systems engineering practices to improve architecture, interfaces, and risk management.
• Strengthen V&V, equipment qualification, reliability engineering, and problem solving.
• Establish change control, configuration management, and lifecycle practices.
• Lead NPI and collaborate with Manufacturing, Quality, Supply Chain, Service, and PM.
• Improve reliability, availability, serviceability, safety, manufacturability, and field performance.
• Resolve complex technical issues spanning hardware, software, controls, and process performance.
• Develop leaders and accountability for programs, schedules, and product performance.
• Manage resources, budgets, labs, external partners, and suppliers.
• Set and communicate KPIs and program status to executive leadership.

Skills

Engineering leadership

Semiconductor capital equipment

NPI & V&V

Product lifecycle management

Staffing & budgets

Cross-functional leadership

Systems engineering

Education

Bachelor's degree in Mechanical, Electrical, Chemical, Materials, Systems, or related engineering

Tools

PLCs

Automation software

Job description

A growing advanced technology manufacturer is seeking a Vice President of Engineering to lead the development and commercialization of sophisticated semiconductor capital equipment and wafer-processing systems.

This is a senior leadership opportunity for an engineering executive with significant experience in the semiconductor equipment industry and a track record of bringing complex equipment platforms from development into manufacturing and commercial deployment.

The successful candidate will lead a multidisciplinary engineering organization spanning mechanical, electrical, controls, software, systems, process, and reliability engineering. The role requires someone who can connect product strategy and technical direction with disciplined engineering execution, New Product Introduction (NPI), verification and validation (V&V), product reliability, configuration control, manufacturing readiness, and lifecycle support.

Candidates do not need to currently hold a Vice President title. Accomplished Senior Directors, Engineering Directors, Managing Directors, Business Unit leaders, and other senior semiconductor equipment leaders ready for broader VP-level responsibility are encouraged to apply.

Key Responsibilities

• Lead a multidisciplinary engineering organization responsible for complex semiconductor capital equipment and wafer-processing platforms.
• Establish engineering priorities and product roadmaps supporting new equipment development, existing product advancement, customer requirements, and long-term technology strategy.
• Provide leadership across mechanical engineering, electrical engineering, controls and automation, software, systems engineering, process engineering, and product reliability.
• Guide new equipment programs from product definition and architecture through design, integration, testing, qualification, production introduction, and commercial deployment.
• Drive systems engineering practices that improve product architecture, technical interfaces, design decisions, risk management, and overall equipment performance.
• Strengthen verification and validation (V&V), equipment qualification, reliability engineering, and structured technical problem solving.
• Establish effective configuration management, engineering change control, and product lifecycle practices as equipment platforms mature.
• Lead New Product Introduction (NPI) and partner closely with Manufacturing, Quality, Supply Chain, Service, Program Management, and commercial teams to ensure successful transfer from engineering into production.
• Improve equipment reliability, availability, serviceability, safety, manufacturability, and field performance.
• Lead resolution of complex technical issues involving hardware, software, controls, automation, process performance, and subsystem integration.
• Develop engineering managers and technical leaders while establishing accountability for programs, schedules, technical execution, and product performance.
• Manage engineering resources, staffing, budgets, laboratories, capital requirements, outside engineering resources, suppliers, and strategic technical partners.
• Establish engineering KPIs and communicate program status, technical risks, priorities, and resource requirements to executive leadership.

The strongest candidates will have spent a significant portion of their careers within semiconductor capital equipment, semiconductor manufacturing equipment, wafer-processing equipment, or closely related advanced process equipment.

Qualifications should include:

• Approximately 15+ years of progressive engineering experience, including significant engineering leadership responsibility.
• Demonstrated experience leading complete capital-equipment platforms or major equipment product families, rather than a career focused primarily on individual process development or research.
• Leadership of multidisciplinary engineering teams across several technical functions.
• Experience taking complex equipment through product development, system integration, qualification, NPI, manufacturing transfer, production scale-up, customer deployment, and lifecycle improvement.
• Strong understanding of product reliability, V&V, configuration control, engineering change management, root-cause analysis, FMEA, and structured product development.
• Experience developing equipment for demanding semiconductor fab or advanced manufacturing environments.
• Demonstrated ability to build engineering organizations, develop technical leaders, and improve engineering execution.
• Bachelor's degree in Mechanical, Electrical, Chemical, Materials, Systems, or another relevant engineering discipline. An advanced technical or business degree is a plus.

Experience with semiconductor equipment incorporating several of the following technologies is highly desirable:

• Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), etch, and thin-film processing
• 200 mm and 300 mm wafer-processing platforms
• Vacuum systems and vacuum process equipment
• Process chambers and deposition systems
• High-purity gas and precursor delivery
• Wafer handling, robotics, and automated material transfer
• Load locks, vacuum transfer, cluster tools, and multi-module equipment
• Motion control, mechatronics, sensors, and instrumentation
• PLCs, equipment controls, automation, and semiconductor equipment software
• Equipment integration, qualification, diagnostics, and field support

Candidates are not expected to have experience with every technology listed above. The priority is a combination of deep semiconductor capital-equipment experience, broad engineering leadership, and responsibility for commercially deployed equipment platforms.

The Opportunity

This role provides the opportunity to shape both an engineering organization and the next generation of advanced semiconductor equipment. The VP of Engineering will have significant influence over product architecture, equipment development, engineering processes, NPI, product reliability, manufacturing readiness, technical talent, and long-term platform strategy.

• Base salary: $150,000–$225,000, depending on experience and qualifications
• Medical, dental, and vision insurance
• Disability and life insurance
• Paid holidays and PTO
• Flexible Spending Account
• 401(k) with company match

The position is primarily on-site in the Denver, Colorado area, with periodic domestic and international travel.

Qualified candidates with experience in semiconductor capital equipment, semiconductor manufacturing equipment, wafer-processing systems, ALD, CVD, PVD, etch, thin-film deposition, vacuum processing, 200 mm/300 mm equipment, or related semiconductor equipment technologies are encouraged to apply.