Thin Film Deposition Engineer — Drive Wafer Yield

WD; San Jose (CA); On-site; USD 95,000 - 140,000; Full time

Benefits offered by this job

Paid vacation

Medical/Dental/Vision

401(k) plan

Employee stock purchase plan

Life insurance

Job summary

Western Digital in California is seeking an engineer to sustain vacuum thin film deposition via PVD/IBD and to characterize thin film properties such as XRF, XRR, TEM and related magnetic features.

You will analyze wafer processing and probing results, correlate to processing steps, and collaborate with the advanced reader development group to transfer new deposition processes into production and qualify new tools.

Qualifications

• BS or MS in Engineering, Physics, Materials Science, or a related field.
• 2 years of thin film deposition experience preferred.
• Magnetic background preferred.
• Strong statistical data analysis skills preferred.

Responsibilities

• Sustain vacuum thin film deposition using PVD/IBD and characterize properties (XRF, XRR, TEM, BH-Looper, magnetic properties).
• Analyze wafer processing and probing results; correlate to processing steps to resolve production yield and quality issues.
• Perform and coordinate wafer-level failure analysis related to reader thin film deposition processes (TEM analysis, wafer-level SPC).
• Collaborate with advanced reader development to transfer new deposition processes into production and qualify new tools.

Skills

Statistical data analysis

Education

BS or MS in Engineering/Physics/Materials Science or related field

Job description

Western Digital in California is seeking an engineer to sustain vacuum thin film deposition via PVD/IBD and to characterize thin film properties such as XRF, XRR, TEM and related magnetic features.

You will analyze wafer processing and probing results, correlate to processing steps, and collaborate with the advanced reader development group to transfer new deposition processes into production and qualify new tools.