Thermal-Mechanical Packaging Engineer, Silicon (Starlink)

United States Digital Space LLC; Bastrop (TX); On-site; USD 70,000 - 90,000; Full time

Job summary

United States Digital Space LLC is seeking a Thermal Mechanical Test Engineer for Silicon Packaging to develop thermal and mechanical modeling for advanced semiconductor packaging. In this role, you will support efforts to ensure the reliability of Starlink hardware.

The ideal candidate will possess a Bachelor’s in engineering or related STEM discipline, with at least a year of experience in thermal or mechanical testing. The role involves extensive data analysis and collaboration across teams.

Qualifications

• 1+ years of experience with thermal or mechanical modeling and testing in an industry or academic setting.
• Experience with board-level thermal testing and characterization using thermocouple mapping and infrared thermography.

Responsibilities

• Develop and run thermal and mechanical finite element models.
• Design, set up, and execute thermal and mechanical test campaigns.
• Analyze test data and provide feedback to packaging and design teams.

Skills

Thermal modeling

Mechanical testing

Finite element analysis

Data analysis using Python or MATLAB

Education

Bachelor’s degree in engineering, math, or science

Tools

ANSYS

Abaqus

COMSOL

Flotherm

Icepak

Job description

United States Digital Space LLC is seeking a Thermal Mechanical Test Engineer for Silicon Packaging to develop thermal and mechanical modeling for advanced semiconductor packaging. In this role, you will support efforts to ensure the reliability of Starlink hardware.

The ideal candidate will possess a Bachelor’s in engineering or related STEM discipline, with at least a year of experience in thermal or mechanical testing. The role involves extensive data analysis and collaboration across teams.