Thermal Mechanical Test Engineer, Silicon Packaging (Starlink)

United States Digital Space LLC; Bastrop (TX); On-site; USD 70,000 - 90,000; Full time

Job summary

United States Digital Space LLC is seeking a Thermal Mechanical Test Engineer for Silicon Packaging to develop thermal and mechanical modeling for advanced semiconductor packaging. In this role, you will support efforts to ensure the reliability of Starlink hardware.

The ideal candidate will possess a Bachelor’s in engineering or related STEM discipline, with at least a year of experience in thermal or mechanical testing. The role involves extensive data analysis and collaboration across teams.

Qualifications

• 1+ years of experience with thermal or mechanical modeling and testing in an industry or academic setting.
• Experience with board-level thermal testing and characterization using thermocouple mapping and infrared thermography.

Responsibilities

• Develop and run thermal and mechanical finite element models.
• Design, set up, and execute thermal and mechanical test campaigns.
• Analyze test data and provide feedback to packaging and design teams.

Skills

Thermal modeling

Mechanical testing

Finite element analysis

Data analysis using Python or MATLAB

Education

Bachelor’s degree in engineering, math, or science

Tools

ANSYS

Abaqus

COMSOL

Flotherm

Icepak

Job description

the company was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today the company is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

THERMAL MECHANICAL TEST ENGINEER, SILICON PACKAGING (STARLINK)

the company is leveraging our experience building rockets and spacecraft to deploy Starlink, the world’s largest satellite constellation and most advanced broadband internet system. We provide reliable and fast internet to millions of users worldwide, including populations with little or no connectivity, rural communities, aircraft, watercraft, and places where existing services are unreliable, too expensive, or disconnected by natural disasters. We design, build, test, and operate all parts of the system, thousands of satellites and consumer dishes that allow users to connect within minutes of unboxing. The Starlink team is seeking out the best-in-class professionals to maximize Starlink’s potential for communities and businesses around the globe.

As a Thermal Mechanical Test Engineer for Silicon Packaging at the company, you will develop and execute thermal and mechanical modeling and test programs for advanced semiconductor packaging and board‑level assemblies. You will support the silicon packaging process engineering organization by characterizing package and board thermal performance, validating mechanical robustness, and correlating simulation results with physical test data to enable high‑volume production of reliable Starlink hardware.

RESPONSIBILITIES

• Develop and run thermal and mechanical finite element models, and thermal simulations, to predict package and board-level behavior under operational and environmental conditions
• Develop process models to support new production line bring‑up and investigations into packaging processes
• Design, set up, and execute thermal and mechanical test campaigns
• Perform board-level thermal characterization and testing to evaluate heat spreading, junction temperatures, and system-level thermal performance
• Operate and maintain thermal and mechanical test equipment, such as thermal chambers, along with instrumentation, including thermocouples and infrared cameras
• Analyze test data, correlate models with empirical results, and provide actionable feedback to packaging, silicon design, and manufacturing teams
• Support new package and board designs through test planning, execution, and data reporting
• Collaborate cross-functionally with packaging process engineers, hardware design teams, production operations, and quality to integrate test insights into product development and production ramp

BASIC QUALIFICATIONS

• Bachelor’s degree in an engineering, math, or science discipline
• 1+ years of experience with thermal or mechanical modeling and testing in an industry or academic setting

PREFERRED SKILLS AND EXPERIENCE

• Bachelor’s in mechanical engineering, materials science, aerospace engineering, physics, applied mathematics, or other STEM discipline
• Advanced degree in an engineering, math, or science discipline
• Experience with board-level thermal testing and characterization using thermocouple mapping, power dissipation testing, or infrared thermography
• Experience using finite element analysis or thermal simulation tools such as ANSYS, Abaqus, COMSOL, Flotherm, or Icepak
• Experience with 3D and reduced-order thermal and mechanical modeling
• Experience correlating simulation models with physical test data
• Experience in simulation and characterization of IC packaging thermal resistance parameters
• Proficiency in Python or MATLAB for data analysis and post-processing
• Background in semiconductor packaging or high-reliability electronics environments
• Experience working in a fast-paced, high-volume manufacturing or new product introduction setting

ADDITIONAL REQUIREMENTS

• Ability to work extended hours or weekends as needed for mission critical deadlines

ITAR REQUIREMENTS

• To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.

the company is an Equal Opportunity Employer; employment with the company is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

Applicants wishing to view a copy of the company’s affirmative action plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to [e-mail]