Technical Support Engineer (Package Substrate) Bilingual in Korean

Cesna Recruitment; Cupertino (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Cesna-Recruitment is seeking a senior substrate development professional to provide technical support for customer development programs (Mobile AiP, SiP, FC-CSP, RF) and to lead design reviews and production readiness initiatives. The role involves frequent travel to customer sites within the United States and periodic visits to Korea for engineering reviews.

The candidate should have a Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or a related field, with 10+ years

Qualifications

• Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or a related field.
• 10+ years in package substrate development, process or customer engineering, or technical marketing.
• Proven record of leading substrate projects through mass production.
• Experience supporting major semiconductor customers preferred.
• Deep knowledge of substrate processes, materials, structures, and design rules.
• Hands-on experience with ABF, ETS, Hybrid Stack-up, Cavity, Fine Pattern, and RF.
• Ability to translate customer requirements into technical solutions.
• Experience in NPI, yield improvement, and production transfer.
• Strong customer relationship management skills.
• Clear technical presentation and communication skills.
• Project management and problem-solving capability.
• MS Office (PowerPoint, Excel, Word).
• Six Sigma Green Belt or equivalent preferred.
• PMP or equivalent project management certification preferred.

Responsibilities

• Provide technical support for customer development programs (Mobile AiP, SiP, FC-CSP, RF).
• Resolve technical issues and drive performance stabilization at the customer.
• Identify and develop PoC opportunities through customer engagement.
• Guide BOM and substrate structure selection using LGIT technicalsolutions.
• Lead design reviews, TRA assessments, yield improvement, and production readiness.
• Coordinate between customer engineering and LGIT R&D, Process, Quality, and Manufacturing.
• Conduct regular customer meetings and technical presentations.
• Collect customer VOC and market intelligence to shape technology roadmaps.
• Support technology promotions, exhibitions, and strategic customer engagements.
• Promote advanced substrate technologies (Hybrid Stack-up, Fine Pattern, Cavity, Hyper Flex).
• Travel: On-site customer support with frequent engagement; frequent travel to U.S. sites; periodic travel to Korea for engineering and business reviews.

Skills

Bilingual English & Korean

MS Office

Education

Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or related field

Six Sigma Green Belt

PMP or equivalent project management certification

Tools

ABF

ETS

Hybrid Stack-up

Cavity

Fine Pattern

RF

Job description

1) Main Responsibilities

• - Provide technical support for customer development programs (Mobile AiP, SiP, FC-CSP, RF).
• - Resolve technical issues and drive performance stabilization at the customer.
• - Identify and develop PoC opportunities through customerengagement.
• - Guide BOM and substrate structure selection using LGIT technicalsolutions.
• - Lead design reviews, TRA assessments, yield improvement, and production readiness.
• - Coordinate between customer engineering and LGIT R&D, Process,Quality, and Manufacturing.

2) Others

• - Conduct regular customer meetings and technical presentations.
• - Collect customer VOC and market intelligence to shape technology roadmaps.
• - Support technology promotions, exhibitions, and strategic customer engagements.
• - Promote advanced substrate technologies (Hybrid Stack-up, Fine Pattern, Cavity, Hyper Flex).
• - Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or a related field.
• - Bilingual in both English and Korean
• - - 10+ years in package substrate development, process or customer engineering, or technical marketing.
• - Proven record of leading substrate projects through mass production.
• - Experience supporting major semiconductor customers preferred.
• - Deep knowledge of substrate processes, materials, structures, and design rules.
• - Hands-on experience with ABF, ETS, Hybrid Stack-up, Cavity, Fine Pattern, and RF.
• - Ability to translate customer requirements into technical solutions.
• - Experience in NPI, yield improvement, and production transfer.
• - Strong customer relationship management skills.
• - Clear technical presentation and communication skills.
• - Project management and problem-solving capability.
• - MS Office (PowerPoint, Excel, Word).
• - Six Sigma Green Belt or equivalent preferred.
• - PMP or equivalent project management certification preferred.

Travel:

• - On-site customer support with frequent customer engagement.
• - Frequent travel to customer sites within the U.S.
• - Periodic travel to Korea for engineering and business reviews.