Technical Support Engineer (Package Substrate) Bilingual in Korean

Cesna Recruitment; Cupertino (CA); Presencial; USD 150.000 - 210.000; Jornada completa

Descripción de la vacante

Cesna Recruitment is seeking a senior packaging substrate expert to provide technical support for customer development programs and drive performance improvements across multiple projects. You will lead design reviews, guide BOM/substrate choices, and coordinate with R&D and manufacturing teams to ensure readiness for mass production.

The role requires 10+ years in substrate development or related areas, strong communication, and the ability to travel on-site to customer sites in the U.S.

Formación

• Bachelor's degree or higher in a relevant field.
• 10+ years in package substrate development, process, or customer engineering.
• Proven record leading substrate projects through mass production.
• Ability to translate customer requirements into technical solutions.
• Deep knowledge of substrate processes, materials, structures, and design rules.
• Hands-on experience with ABF, ETS, Hybrid Stack-up, Cavity, Fine Pattern, RF.
• Experience in NPI, yield improvement, and production transfer.
• Six Sigma Green Belt or PMP preferred.

Responsabilidades

• Provide technical support for customer development programs (Mobile AiP, SiP, FC-CSP, RF).
• Resolve technical issues and drive performance stabilization at the customer.
• Identify and develop PoC opportunities through customer engagement.
• Guide BOM and substrate structure selection using LGIT technicalsolutions.
• Lead design reviews, TRA assessments, yield improvement, and production readiness.
• Coordinate between customer engineering and LGIT R&D, Process, Quality, and Manufacturing.

Conocimientos

Bilingual English Korean

Customer relationship management

Presentation skills

Project management

Problem solving

MS Office

Educación

Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or related field

Descripción del empleo

1) Main Responsibilities

• - Provide technical support for customer development programs (Mobile AiP, SiP, FC-CSP, RF).
• - Resolve technical issues and drive performance stabilization at the customer.
• - Identify and develop PoC opportunities through customerengagement.
• - Guide BOM and substrate structure selection using LGIT technicalsolutions.
• - Lead design reviews, TRA assessments, yield improvement, and production readiness.
• - Coordinate between customer engineering and LGIT R&D, Process,Quality, and Manufacturing.

2) Others

• - Conduct regular customer meetings and technical presentations.
• - Collect customer VOC and market intelligence to shape technology roadmaps.
• - Support technology promotions, exhibitions, and strategic customer engagements.
• - Promote advanced substrate technologies (Hybrid Stack-up, Fine Pattern, Cavity, Hyper Flex).
• - Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or a related field.
• - Bilingual in both English and Korean
• - - 10+ years in package substrate development, process or customer engineering, or technical marketing.
• - Proven record of leading substrate projects through mass production.
• - Experience supporting major semiconductor customers preferred.
• - Deep knowledge of substrate processes, materials, structures, and design rules.
• - Hands-on experience with ABF, ETS, Hybrid Stack-up, Cavity, Fine Pattern, and RF.
• - Ability to translate customer requirements into technical solutions.
• - Experience in NPI, yield improvement, and production transfer.
• - Strong customer relationship management skills.
• - Clear technical presentation and communication skills.
• - Project management and problem-solving capability.
• - MS Office (PowerPoint, Excel, Word).
• - Six Sigma Green Belt or equivalent preferred.
• - PMP or equivalent project management certification preferred.

Travel:

• - On-site customer support with frequent customer engagement.
• - Frequent travel to customer sites within the U.S.
• - Periodic travel to Korea for engineering and business reviews.