Technical Program Manager

Foxconn Industrial Internet - FII; Cupertino (CA); On-site; USD 130,000 - 160,000; Full time

Job summary

Foxconn Industrial Internet - FII is seeking a Technical Project Manager to lead mechanical and thermal hardware development for AI servers and data center platforms. You will coordinate across engineering, manufacturing, suppliers, and customers from concept to mass production.

The role requires strong project management, manufacturing process optimization, and problem-solving skills, with travel up to 40% and Mandarin/English fluency.

Qualifications

• BS or MS in Mechanical Engineering or related technical field.
• 5+ years in technical project management, NPI, or mechanical product development.
• Fluent in Mandarin and English.
• Strong understanding of mechanical design and manufacturing processes.

Responsibilities

• Lead cross-functional hardware programs from concept through mass production.
• Manage schedules, milestones, risks, and dependencies across engineering, manufacturing, and suppliers.
• Oversee mechanical and thermal component development via machining, molding, stamping, forging, casting, and cooling assemblies.
• Support thermal system integration for AI servers and data center applications.
• Drive DFM/DFA, GD&T, DOE, FMEA, reliability validation, and manufacturing optimization.
• Lead prototype builds, readiness reviews, and ramp to production.

Skills

Cross-functional leadership

Technical project management

NPI

Mechanical design

Heat transfer/thermodynamics

CAD tools

Education

BS or MS in Mechanical Engineering

Tools

Siemens NX

Creo

SolidWorks

JMP

Minitab

Job description

Technical Project Manager – Mechanical Systems, Thermal Solutions & Manufacturing Position Summary

We are seeking a highly motivated Technical Project Manager to lead the development and industrialization of advanced mechanical and thermal hardware solutions for AI servers, data center infrastructure, HPC, and next-generation computing platforms. This role serves as the primary interface between engineering, manufacturing, suppliers, and customers to drive programs from concept through NPI, qualification, and mass production.

The ideal candidate combines strong technical expertise in mechanical systems, thermal solutions, and manufacturing processes with exceptional communication and problem-solving skills. This role requires the ability to lead cross-functional teams, manage technical risks, optimize manufacturing processes, and deliver high-quality products on schedule.

Responsibilities

• Lead cross-functional hardware development programs from concept, NPI, validation, qualification, and mass production.
• Manage project schedules, milestones, risks, dependencies, and deliverables while aligning engineering, manufacturing, quality, sourcing, suppliers, and customers.
• Drive development and industrialization of mechanical and thermal components via processes such as machining, molding, stamping, forging, casting, and liquid cooling assemblies.
• Support thermal system integration involving cold plates, manifolds, pumps, vapor chambers, heat pipes, and related cooling solutions for AI servers and data center applications.
• Drive DFM/DFA, GD&T, tolerance analysis, DOE, FMEA, reliability validation, and manufacturing optimization activities.
• Lead prototype builds, manufacturing readiness reviews, production ramp, and sustaining engineering activities.
• Resolve technical and manufacturing issues through root cause analysis, data analysis, corrective actions, and continuous improvement.
• Evaluate new materials, manufacturing processes, and technologies to improve product performance, quality, reliability, and cost.
• Communicate program status, technical risks, and engineering decisions through technical reviews and customer presentations.

Qualifications

• BS or MS degree in Mechanical Engineering, Thermal Engineering, Materials Science, Manufacturing Engineering, or related technical field.
• 5+ years of experience in technical project management, NPI, mechanical product development, thermal engineering, or manufacturing engineering. Qualified entry-level candidates will also be considered.
• Fluent in Mandarin and English.
• Strong understanding of mechanical design and manufacturing processes such as including machining, molding, stamping, forging, casting, joining, and assembly.
• Knowledge of heat transfer, fluid mechanics, thermodynamics, and mechanical system design.
• Experience with DFM, DFA, GD&T, DOE, FMEA, reliability engineering, and root cause analysis.
• Familiarity with CAD tools such as Siemens NX, Creo, SolidWorks, or equivalent.
• Experience with data analysis tools such as JMP, Minitab, or equivalent.
• Strong project management, analytical, communication, and cross-functional leadership skills.
• Willingness to travel internationally up to 40%.

Preferred Qualifications

• Experience supporting mechanical components and systems from AI servers, GPU systems, HPC, networking, or consumer electronics products.
• Experience with liquid cooling systems, cold plates, vapor chambers, CDU interfaces, manifolds, pumps, or thermal module integration.
• Familiarity with CFD/FEA simulation tools such as ANSYS Icepak, Fluent, Star-CCM+, FloTHERM, or equivalent.
• Experience on advanced manufacturing, including precision machining, brazing, diffusion bonding, welding, or additive manufacturing.
• Experience with JDM/ODM co-development programs and global customer engagement.
• Experience with failure analysis methods such as SEM, EDX, FTIR, or equivalent analytical techniques.

Job location-Cupertino/San Francisco, CA

Salary range- $130k-$160k