Tape-Out Program Manager / Technical Program Manager (Semiconductor)-Dallas, TX- Onsite

KAnand Corporation; Dallas (TX); Presencial; USD 140.000 - 190.000; Jornada completa

Descripción de la vacante

KAnand Corporation seeks an experienced Tape-Out Program Manager to lead ASIC/SoC programs from concept through silicon delivery in Dallas, TX. You will orchestrate cross-functional teams across Architecture, Design, Verification, Physical Design, DFT, CAD, Product Engineering, and Foundry partners to hit tape-out milestones.

The ideal candidate has 8–15 years in semiconductor program management, deep knowledge of RTL to GDSII, and a proven ability to drive schedules, manage risks, and deliver

Formación

• 8–15 years of TPM experience in semiconductors and tape-out programs.
• Deep knowledge of ASIC/SoC development lifecycle and tape-out flow.
• Experience coordinating cross-functional teams across RTL, verification, physical design, and foundries.
• PMP/ PMI-ACP or Agile preferred.

Responsabilidades

• Lead end-to-end tape-out programs from concept to silicon delivery.
• Create and maintain integrated program plans, milestones, and dependencies.
• Track tape-out deliverables and sign-off readiness across teams.
• Coordinate across Design, Verification, Physical Design, DFT, Packaging, and Foundry.
• Manage risks, issues, and mitigation plans; drive exec reporting.
• Oversee schedule alignment with internal teams and external vendors.
• Ensure closure of critical path items before tape-out; manage ECOs and changes.
• Support silicon bring-up and post-silicon activities.

Conocimientos

Semiconductor domain knowledge

ASIC/SoC lifecycle

Tape-out process

RTL to GDSII familiarity

Project planning & scheduling

Executive communication

Risk & dependency management

Educación

Bachelor's or Master's in Electronics, VLSI, Computer Engineering

Herramientas

Azure DevOps

Jira

Microsoft Project

Excel / Power BI

Confluence

Smartsheet

Descripción del empleo

Tape-Out Program Manager / Technical Program Manager (Semiconductor)

Experience: 8-15 Years

Duration :12+ Months

Role Summary

We are seeking an experienced Technical Program Manager (TPM) to lead and manage ASIC/SoC tape-out programs from concept through silicon delivery. The TPM will coordinate cross-functional teams including Architecture, Design, Verification, Physical Design, DFT, CAD, Product Engineering, and Foundry partners to achieve successful tape-out milestones.

Key Responsibilities

Drive end-to-end semiconductor product development and tape-out schedules. Create and maintain integrated program plans, milestones, and dependencies. Track critical tape-out deliverables and sign-off readiness. Coordinate across Design, Verification, Physical Design, DFT, Packaging, and Foundry teams. Identify program risks, issues, and mitigation plans. Lead project status reviews and executive reporting. Manage schedule alignment between internal teams and external vendors. Ensure closure of critical path items before tape-out. Track engineering metrics, resource utilization, and budget. Facilitate program reviews, go/no-go decisions, and tape-out readiness assessments. Manage change requests, ECOs, and project scope adjustments. Support silicon bring-up and post-silicon activities. Required Skills Semiconductor Domain ASIC/SoC Development Lifecycle Tape-Out Process RTL to GDSII Flow Physical Design DFT Concepts Design Verification Timing Closure DRC/LVS Sign-off Silicon Validation Foundry Engagement Program Management Project Planning & Scheduling Stakeholder Management Risk Management Dependency Tracking Budget Management Executive Communication Resource Planning Vendor Management Tools Azure DevOps (ADO) Jira Microsoft Project Excel / Power BI Confluence Smartsheet Preferred Qualifications Bachelor's or Master's degree in Electronics, VLSI, Computer Engineering, or related field. Experience managing multiple ASIC/SoC tape-outs. Knowledge of semiconductor manufacturing and foundry processes. PMP, PMI-ACP, or Agile certification preferred. Success Metrics On-time Tape-Out Delivery Schedule Adherence Sign-off Readiness Risk Closure Rate Silicon Success Rate Budget Compliance TPM Deliverables for Tape-Out Programs If you're interviewing or positioning yourself as a Semiconductor TPM, you can highlight: Program planning and milestone management Cross-functional coordination ADO/JIRA governance Risk and dependency management Executive dashboards and reporting Tape-out readiness reviews Foundry coordination Budget and resource tracking Post-silicon issue management Requirement traceability and closure tracking