System Test HW Engineer, Amazon LEO

Amazon; Redmond (WA); On-site; USD 136,000 - 184,000; Full time

Benefits offered by this job

health insurance

401(k) matching

paid time off

parential leave

Job summary

Amazon's Amazona LEO team is seeking a HW Development Engineer to own PCB design for test and SW platforms enabling validation of a next-generation MODEM SOC. You will collaborate with silicon, firmware, and software engineers to accelerate tape-out to orbit.

You will design, optimize, and validate PCB schematics and layouts using Siemens Xpedition, ensuring SI/PI goals and high-speed interfaces are met while supporting bring-up and ECO management across cross-functional groups.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 5+ years in multi-layer PCB design for mixed-signal systems.
• Experience with high-speed interfaces and PCB fabrication/bring-up.

Responsibilities

• Design, optimize and develop PCB schematics and layouts for SOC validation and SW development platforms using Siemens Xpedition
• Collaborate with post-silicon engineers to define board requirements including debug access and high-speed interface breakout
• Work with firmware and software teams to meet early SW bring-up and driver development needs
• Translate silicon requirements into board-level implementations with cross-functional teams
• Review SI/PI analysis and incorporate recommendations into layout
• Own the board lifecycle from concept to fabrication, assembly, bring-up, and ECO management

Skills

PCB design

High-speed interfaces

Signal integrity

Power integrity

Lab bring-up

Cross-functional collaboration

Education

Bachelor's degree in Electrical Engineering

Tools

Siemens Xpedition

HyperLynx

Ansys SIwave

Job description

Amazona LEO is expanding global broadband access through a constellation of low Earth orbit satellites. You will be part of a team that works on cutting edge silicon design - chips engineered to operate in the harsh environment of space. We are looking for an HW Development Engineer to join the ASIC Team and own PCB design for Test and SW development platforms that enable validation and bring-up of our next-generation MODEM SOC. In this role, you will collaborate closely with silicon, firmware, and software engineers to build hardware that accelerates the path from tape-out to orbit.

Key Job Responsibilities

• Design, optimize and develop PCB schematics and layouts for SOC validation and SW development platforms using Siemens Xpedition
• Collaborate with post-silicon engineers to define board requirements including debug access, instrumentation tap points, and high-speed interface breakout (SerDes, DDR, Ethernet SGMII/RGMII)
• Work with firmware and software teams to ensure development boards meet early SW bring-up and driver development needs
• Work with cross-functional teams (ASIC, firmware, mechanical) to translate silicon requirements into board-level implementations
• Review signal integrity and power integrity analysis; incorporate SI/PI recommendations into layout
• Own the board lifecycle from concept through fabrication, assembly, bring-up, and ECO management

Export Control Requirement

Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Basic Qualifications

• Bachelor's degree in Electrical Engineering or a related field
• 5+ years of experience in multi-layer PCB design (8+ layers) for mixed-signal systems
• Proficiency in Siemens Xpedition for schematic capture and layout
• Experience with high-speed digital interfaces: DDR, SerDes, Ethernet (SGMII, RGMII)
• Working knowledge of low-speed protocols: I2C, SPI, I3C
• Understanding of impedance-controlled routing and high-speed PCB design best practices
• Experience with PCB fabrication, assembly processes, and lab bring-up

Preferred Qualifications

• Experience designing validation/development platforms with emphasis on debug accessibility and flexibility
• Ability to review and interpret SI/PI simulation results (HyperLynx, Ansys SIwave, or similar)
• Knowledge of power delivery network (PDN) design and high-density BGA fanout routing
• Experience supporting firmware/SW development hardware needs (JTAG, UART, boot mode configurations)
• Familiarity with revision control systems and collaborative design environments
• MODEM or communications system hardware background

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

Amazon also offers comprehensive benefits including:

• health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage)
• 401(k) matching
• paid time off
• parental leave

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location.

USA, TX, Austin - 136,000.00 - 184,000.00 USD annually

USA, WA, Redmond - 136,000.00 - 184,000.00 USD annually

Company - Amazon Kuiper Manufacturing Enterprises LLC

Job ID: A10495422