Summer Modular Engineering Intern: AI Infrastructure

QUALCOMM, Inc.; Los Altos (CA); On-site; USD 23,000 - 135,000; Full time

Benefits offered by this job

Relocation coverage

Furnished housing accommodations

Job summary

Qualcomm Technologies, Inc. invites energetic students to join the Modular Engineering internship track for Summer 2027 across multiple U.S. locations. You will contribute to AI infrastructure, model serving, and software development within AI/ML projects.

The program pairs interns with mentors, provides professional development workshops, and offers relocation coverage and furnished housing. Applicants must be enrolled in a degree program and available for 11–14 weeks.

Qualifications

• Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer science, computer engineering, electrical engineering, software engineering, mathematics, artificial intelligence, or a related technical field.
• Must be available for 11–14 weeks during Summer 2027 (May–September).
• Expected graduation date of November 2027 or later.
• 1+ years of academic or project experience with programming languages such as Python, C, C++, Rust, Go, or related languages.

Skills

Python

C++

C

Rust

Go

MLIR/LLVM knowledge

Education

Bachelor's/Master's/PhD in CS/CE/EE/SE/Math/AI or related field

Tools

PyTorch

TensorFlow

Hugging Face

Nsight

MLIR

LLVM

Job description

Qualcomm Technologies, Inc. invites energetic students to join the Modular Engineering internship track for Summer 2027 across multiple U.S. locations. You will contribute to AI infrastructure, model serving, and software development within AI/ML projects.

The program pairs interns with mentors, provides professional development workshops, and offers relocation coverage and furnished housing. Applicants must be enrolled in a degree program and available for 11–14 weeks.