Staff Technical Product Manager - Electronics AI & HPC Simulation

Ansys, Inc.; United States; On-site; USD 180,000 - 260,000; Full time

Benefits offered by this job

Bonus potential

Equity

Comprehensive benefits

Job summary

Ansys Electronics, part of Synopsys, seeks a technically strong product leader to shape AI-powered simulation capabilities across HFSS, Icepak, and AEDT. The role focuses on scaling AI, HPC, and platform interoperability for high-performance electronics design.

You will work with R&D to define direction, guide implementation, and solve complex workflow and system-level challenges, including interoperability with NVIDIA Omniverse.

Qualifications

• Experience translating engineering needs into scalable product capabilities.
• Strong background in AI/ML and HPC within electronics simulation.
• Skilled in collaborating with R&D to drive technical direction.

Responsibilities

• Define AI and HPC capabilities across HFSS, Icepak, AEDT.
• Prioritize AI use cases: setup assistance, model generation, solver guidance.
• Support HPC patterns across distributed compute, GPU, cloud.
• Extend AEDT into third-party ecosystems via APIs and data models.
• Collaborate with R&D, UX, field teams, and customers to validate priorities.

Skills

AI/ML expertise

HPC deployment

Python scripting

APIs & interoperability

Simulation workflows

Electromagnetics & thermal design

Technical leadership

Education

Bachelor's degree in engineering, CS, physics, or related field

Advanced degree preferred

Tools

HFSS

Icepak

Maxwell

AEDT

Job description

About the Job

The preferred location of this role is Bay Area (CA)

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to AI infrastructure and advanced semiconductor systems. As part of Synopsys, Ansys Electronics delivers industry‑leading multiphysics simulation solutions that help customers design high‑performance, thermally efficient, and reliable electronic systems. We are looking for a technically strong product leader to help define and deliver how AI, high‑performance computing, and platform interoperability transform products such as HFSS, Icepak, and the broader Ansys Electronics Desktop platform into scalable, AI‑powered simulation capabilities.

You Are

A technically credible product leader with expertise in simulation, AI/ML, and HPC. You understand advanced electronics workflows and translate engineering needs into scalable product capabilities.

You build shared capabilities, AI‑assisted workflows, and HPC‑enabled solutions that span products and field use cases. You work closely with R&D to define technical direction, guide implementation, and solve complex workflow and system‑level challenges.

You are motivated by solving hard technical problems at scale, including simulation acceleration, intelligent automation, and interoperable platform integrations such as AEDT with NVIDIA Omniverse.

WhatYou'llBe Doing:

• Define core AI and HPC capabilities and reference implementations across HFSS, Icepak, and AEDT.
• Prioritize AI use cases such as set up assistance, model generation, solver guidance, design exploration, and automation.
• Support product and field teams with HPC solution patterns spanning distributed compute, GPU acceleration, orchestration, and cloud deployment.
• Extend AEDT into broader third party ecosystems, through APIs, interoperable data models, and platform services.
• Partner with R&D, UX, field teams, and customers to validate priorities and deliver measurable value.

Key Qualifications

• Define requirements for AI, multiphysics, and scalable compute capabilities grounded in engineering use cases and feasibility.
• Bachelor's degree in engineering, computer science, physics, or a related technical field; advanced degree preferred.
• Strong Python scripting skills, with the ability to automate engineering workflows, develop reusable tools, and work effectively with APIs.
• Familiarity with HFSS, Icepak, Maxwell, AEDT, or comparable simulation environments.
• Knowledge of AI‑assisted engineering workflows, intelligent automation, or engineering data platforms.
• Strong understanding of electromagnetic, thermal, multiphysics, or electronics design workflows.
• Experience with HPC deployment models including multicore, cluster, cloud, and GPU acceleration.
• Understanding of APIs, interoperability, workflow integration, and external technology partnerships.

The Impact You Will Have

You will help shape the future of electronics and AI by driving how simulation evolves for the AI era. Through AI implementation, HPC, and platform integration across Ansys Electronics within Synopsys, you will influence the next generation of technologies powering semiconductors, electronics, intelligent systems, and AI infrastructure.

At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.

In addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job‑related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.