Staff Technical Product Manager – Electronics AI & HPC Simulation

Synopsys Inc; Sunnyvale (CA); Hybrid; USD 180,000 - 240,000; Full time

Job summary

Synopsys Inc. is seeking a technically strong product leader to define AI, HPC, and platform interoperability within Ansys Electronics and Synopsys.

You will guide development across HFSS, Icepak, AEDT, and NVIDIA Omniverse integrations, shaping scalable workflows for electromagnetic, thermal, and multiphysics simulations.

The role emphasizes collaboration with R&D, UX, field teams, and customers to deliver measurable value in the AI era.

Qualifications

• Bachelor’s degree in engineering, computer science, physics, or related field; advanced degree preferred.
• Strong Python scripting skills to automate engineering workflows, develop reusable tools, and work effectively with APIs.
• Familiarity with HFSS, Icepak, Maxwell, AEDT, or comparable simulation environments.
• Knowledge of AI-assisted engineering workflows, intelligent automation, or engineering data platforms.
• Strong understanding of electromagnetic, thermal, multiphysics, or electronics design workflows.
• Experience with HPC deployment models including multicore, cluster, cloud, and GPU acceleration.
• Understanding of APIs, interoperability, workflow integration, and external technology partnerships.

Responsibilities

• Define core AI and HPC capabilities across HFSS, Icepak, and AEDT.
• Prioritize AI use cases such as setup assistance, model generation, solver guidance, design exploration, and automation.
• Support product and field teams with HPC solution patterns spanning distributed compute, GPU acceleration, orchestration, and cloud deployment.
• Extend AEDT into broader third-party ecosystems via APIs and interoperable data models.
• Partner with R&D, UX, field teams, and customers to validate priorities and deliver measurable value.
• Define requirements for AI, multiphysics, and scalable compute capabilities grounded in engineering use cases.

Skills

Python scripting

APIs & interoperability

HPC deployment

AI/ML concepts

Electronics design workflows

Education

Bachelor's degree in engineering/computer science/physics

Advanced degree preferred

Tools

HFSS

Icepak

Maxwell

AEDT

Job description

About The Job

The preferred location of this role is Bay Area (CA)

About The Job

The preferred location of this role is Bay Area (CA)

We Are

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to AI infrastructure and advanced semiconductor systems. As part of Synopsys, Ansys Electronics delivers industry-leading multiphysics simulation solutions that help customers design high-performance, thermally efficient, and reliable electronic systems. We are looking for a technically strong product leader to help define and deliver how AI, high-performance computing, and platform interoperability transform products such as HFSS, Icepak, and the broader Ansys Electronics Desktop platform into scalable, AI-powered simulation capabilities.

You Are

A technically credible product leader with expertise in simulation, AI/ML, and HPC. You understand advanced electronics workflows and translate engineering needs into scalable product capabilities.

You build shared capabilities, AI-assisted workflows, and HPC-enabled solutions that span products and field use cases. You work closely with R&D to define technical direction, guide implementation, and solve complex workflow and system-level challenges.

You are motivated by solving hard technical problems at scale, including simulation acceleration, intelligent automation, and interoperable platform integrations such as AEDT with NVIDIA Omniverse.

What You’ll Be Doing:

• Define core AI and HPC capabilities and reference implementations across HFSS,Icepak, and AEDT.
• Prioritize AI use cases such as set up assistance, model generation, solver guidance, design exploration, and automation.
• Support product and field teams with HPC solution patterns spanning distributed compute, GPU acceleration, orchestration, and cloud deployment.
• Extend AEDT into broader3rdparty ecosystems, through APIs, interoperable data models, and platform services.
• Partner with R&D, UX, field teams, and customers to validate priorities and deliver measurable value.
• Define requirements for AI, multiphysics, and scalable compute capabilities grounded in engineering use cases and feasibility.

Key Qualifications

• Bachelor’s degree in engineering, computer science, physics, or a related technical field; advanced degree preferred.
• Strong Python scripting skills, with the ability to automate engineering workflows, develop reusable tools, and work effectively with APIs.
• Familiarity with HFSS, Icepak, Maxwell, AEDT, or comparable simulation environments.
• Knowledge of AI-assisted engineering workflows, intelligent automation, or engineering data platforms.
• Strong understanding of electromagnetic, thermal, multiphysics, or electronics design workflows.
• Experience with HPC deployment models including multicore, cluster, cloud, and GPU acceleration.
• Understanding ofAPIs, interoperability, workflow integration, and external technology partnerships.

The Impact You Will Have

• You will help shape the future of electronics and AI by driving how simulation evolves for the AI era. Through AI implementation, HPC, and platform integration across Ansys Electronics within Synopsys, you will influence the next generation of technologies powering semiconductors, electronics, intelligent systems, and AI infrastructure.