Staff IC Packaging & Power Modules Engineer

Analog Devices

San Jose (CA)

On-site

USD 130,000 - 188,000

Full time

14 days+

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Benefits offered by this job

Medical, Vision and Dental coverage
401k
Paid vacation
Holidays and sick time

Job summary

Analog Devices, a global semiconductor leader, seeks a Packaging Engineer in San Jose, CA to drive IC package and power module development. The role emphasizes advanced packaging platforms, collaboration with OSATs, and cross-functional teams to ensure timely delivery.

Requirements include a Master’s degree in a relevant field and 3+ years of industrial experience, with PhD preferred. Competitive compensation includes a substantial wage range and comprehensive benefits.

Qualifications

  • Master’s degree in a relevant engineering field with 3+ years of industrial experience.
  • In-depth knowledge of analog IC package and module design and manufacture.
  • Experience with package BOM selection and materials properties.
  • Familiarity with design rules for emerging package platforms.

Responsibilities

  • Drive development and adoption of advanced IC package platforms and processes.
  • Design and optimize IC packages using standard and advanced platforms.
  • Design and optimize power modules for performance and reliability.
  • Define and advance package design rules for new platforms.
  • Collaborate with overseas assembly subcontractors/OSATs on new packaging.
  • Coordinate with reliability, business units and supply chain for packaging.
  • Plan and drive on-time delivery of packaging development projects.

Skills

IC package design
Power module design
Thermal/mechanical analysis
Cross-functional collaboration

Education

Master’s degree in Materials Science and Engineering
Master’s degree in Applied Physics
Master’s degree in Electrical or Mechanical Engineering
PhD preferred

Tools

CAD tools

Job description

Analog Devices, a global semiconductor leader, seeks a Packaging Engineer in San Jose, CA to drive IC package and power module development. The role emphasizes advanced packaging platforms, collaboration with OSATs, and cross-functional teams to ensure timely delivery.

Requirements include a Master’s degree in a relevant field and 3+ years of industrial experience, with PhD preferred. Competitive compensation includes a substantial wage range and comprehensive benefits.

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