Staff Package Design Engineer - Power Modules

Renesas Electronics Corporation; Tempe (AZ); On-site; USD 90,000 - 120,000; Full time

Job summary

Renesas Electronics Corporation in Tempe, Arizona is seeking a skilled professional in semiconductor packaging. This role focuses on designing high-performance package solutions for power modules and advanced architectures.

The ideal candidate will have strong technical expertise in CAD layout, multi-chip designs, and adherence to manufacturing standards. Collaboration across engineering teams is crucial for package optimization and compliance with vendor rules.

Qualifications

• 4+ years of hands-on experience in package CAD layout or advanced package development.
• Strong background in multi-die/chiplet-based architectures.
• Experience interfacing with Tier-1 OSATs and substrate suppliers.

Responsibilities

• Execute package layout design for advanced package technologies.
• Develop CAD databases adhering to design guidelines.
• Manage package design cycles and support Engineering Change Orders.

Skills

Package CAD layout

Power module packaging

High-speed routing

Technical documentation

Education

Bachelor's or Master's degree in Electrical Engineering

Tools

Cadence Allegro Package Designer

Siemens Xpedition Substrate Integrator

Job description

Renesas Electronics Corporation in Tempe, Arizona is seeking a skilled professional in semiconductor packaging. This role focuses on designing high-performance package solutions for power modules and advanced architectures.

The ideal candidate will have strong technical expertise in CAD layout, multi-chip designs, and adherence to manufacturing standards. Collaboration across engineering teams is crucial for package optimization and compliance with vendor rules.