Staff Design Engineer, HBM Architecture

Micron Technology, Inc; Folsom (CA); On-site; USD 146,000 - 297,000; Full time

Job summary

Micron Technology, Inc. is seeking a Staff Design Engineer in the HBM Architecture team to architect, design, and optimize high‑speed datapath circuits for next‑generation high bandwidth memory products.

This role collaborates across design, PHY, ECC, verification, layout, and system groups to deliver robust datapath designs from concept through silicon bring‑up. The candidate will drive datapath architectures for core and logic dies, focusing on bandwidth, power efficiency, reliability, and

Qualifications

• 7+ years of relevant industry experience or 5+ years with a Master’s degree.
• 3+ years of experience in high‑speed digital datapath design (memory, SerDes, or SoC datapath).
• 3+ years of hands‑on experience with digital schematic build, RTL, or mixed‑signal datapath implementations.

Responsibilities

• Architect and design HBM read and write datapath for core and logic die.
• Develop high‑speed datapath circuits for multi‑channel HBM architectures.
• Optimize datapath designs for bandwidth, power, area, and timing closure.
• Design and integrate data reliability features (parity, ECC hooks, lane redundancy).
• Collaborate with design, PHY, verification, and layout teams from concept to silicon bring‑up.
• Drive RTL‑level datapath implementations including clocking and reset strategies.
• Contribute to design reviews, documentation, and mentoring across HBM programs.
• Leverage AI tools to improve productivity and problem solving.

Skills

HBM datapath design

RTL design

Datapath architectures

Education

Bachelor's degree in Electrical Engineering or Computer Engineering

Master's degree (preferred)

Job description

Req ID: JR107757 Staff Design Engineer, HBM Architecture

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job Description

The HBM Architecture team develops advanced datapath solutions that enable industry‑leading bandwidth, power efficiency, reliability, and scalability for Micron’s next‑generation High Bandwidth Memory (HBM) products. The team collaborates closely across design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and core‑die architectures from concept through production.

We are seeking a highly motivated HBM Datapath Architect to architect, design, and optimize high‑speed data paths for next‑generation High Bandwidth Memory (HBM) products! This role focuses on logic‑die and core‑die datapath circuitry, enabling industry‑leading bandwidth, power efficiency, reliability, and scalability across JEDEC and custom HBM solutions. The ideal candidate will work closely with design, PHY, ECC, verification, layout, and system teams to deliver robust datapath designs from concept through silicon bring‑up and production.

Responsibilities will include, but are not limited to:

• Architect and design HBM read and write datapath across core and logic die, including alignment, buffering, timing, and control logic
• Develop high‑speed, low‑latency datapath circuits supporting multi‑channel HBM architectures and wide internal buses
• Optimize datapath designs for bandwidth, power, area, and timing closure at advanced technology nodes
• Design and integrate data reliability features, including parity, ECC hooks, lane redundancy, and remapping mechanisms
• Collaborate with multi‑functional teams to translate specifications into robust micro‑architectures
• Collaborate with PHY, DFT, verification, and layout teams to ensure accurate functionality, testability, and manufacturability
• Drive schematic‑level and RTL‑level datapath implementations, including clocking, gating, and reset strategies
• Contribute to design reviews, documentation, and technical mentoring across HBM programs
• Demonstrate proficiency in using AI‑enabled tools (e.g., Microsoft Copilot and other approved AI solutions) to improve productivity, streamline workflows, analyze information, and accelerate problem solving.

Required Qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 7+ years of relevant industry experience, or a Master’s degree with 5+ years of relevant industry experience.
• 3 + years of experience in high‑speed digital datapath design (memory, SerDes, or SoC datapath).
• 3+ years of hands‑on experience with digital schematic build, RTL, or mixed‑signal datapath implementations.

Preferred Qualifications:

• Strong understanding of HBM/DRAM architectures, including read/write data flow, timing, and multi‑channel operation.
• Working knowledge of layout and floorplanning considerations for high‑speed datapath.
• Experience with static timing analysis (STA) and timing‑closure methodologies.
• Familiarity with advanced process‑node challenges related to signal integrity, skew control, and power optimization.

Job Profile(s):

Systems Design Engineer 4 - Systems Design Engineer 5

Relocation Level: TBD

Before Getting Started

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• Hiring managers may view your performance appraisals, original resume, transcripts or other performance‑related documentation in your personal file. This information will be held in confidence.
• If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

The US base salary range that Micron Technology estimates it could pay for this full‑time position is:

$146,000.00 - $297,000.00 a year

Additional compensation may include benefits, bonuses and equity.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job‑related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.