Sr/ Staff Design Engineer/Architect(Datapath), HBM

Micron Technology, Inc.; Richardson (TX); On-site; USD 140,000 - 210,000; Full time

Benefits offered by this job

Medical benefits

Paid time off

Paid holidays

401(k) plan

Job summary

Micron Technology, Inc. in Richardson, TX seeks a Sr/Staff Design Engineer/Architect (Datapath) for HBM to architect, design and optimize high-speed datapaths for next‑generation memory products.

You will collaborate with design, PHY, ECC, verification and layout teams to bring robust datapath designs from concept to silicon. The ideal candidate has strong background in high‑speed datapath design, RTL and schematic implementations, and hands-on experience with timing closure and reliability

Qualifications

• 6+ years in the industry in electrical/digital design.

Responsibilities

• Architect and design HBM datapath across core and logic die, including timing, buffering and control logic.
• Develop high-speed datapath circuits for multi-channel HBM architectures and wide internal buses.
• Optimize datapath for bandwidth, power, area and timing closure at advanced nodes.
• Design data reliability features: parity, ECC hooks, lane redundancy, remapping.
• Collaborate with design, PHY, ECC, verification, layout and system teams to translate specs into robust micro-architectures.
• Drive RTL and schematic implementations, including clocking, gating and reset strategies.
• Contribute to reviews, documentation, and mentoring across HBM programs.
• Utilize AI to enhance routine engineering tasks.

Skills

High-speed datapath design

RTL design experience

Digital schematic build

Collaboration across teams

Education

Bachelor’s in EE/CE

Master’s degree (advantage)

Tools

RTL tools

EDA tooling

Job description

Sr/ Staff Design Engineer/Architect(Datapath), HBM

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The HBM Architecture team develops advanced datapath solutions that enable industry‑leading bandwidth, power efficiency, reliability, and scalability for Micron’s next‑generation High Bandwidth Memory (HBM) products. The team collaborates closely across design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and core‑die architectures from concept through production.

We are seeking a highly motivated HBM Datapath Engineer to architect, design, and optimize high‑speed data paths for next‑generation High Bandwidth Memory (HBM) products! This role focuses on logic‑die and core‑die datapath circuitry, enabling industry‑leading bandwidth, power efficiency, reliability, and scalability across JEDEC and custom HBM solutions. The ideal candidate will work closely with design, PHY, ECC, verification, layout, and system teams to deliver robust datapath designs from concept through silicon bring‑up and production.

Responsibilities

• Architect and design HBM read and write datapath across core and logic die, including alignment, buffering, timing, and control logic
• Develop high‑speed, low‑latency datapath circuits supporting multi‑channel HBM architectures and wide internal buses
• Optimize datapath designs for bandwidth, power, area, and timing closure at advanced technology nodes
• Design and integrate data reliability features, including parity, ECC hooks, lane redundancy, and remapping mechanisms
• Collaborate with multi‑functional teams to translate specifications into robust micro‑architectures
• Collaborate with PHY, DFT, verification, and layout teams to ensure accurate functionality, testability, and manufacturability
• Drive schematic‑level and RTL‑level datapath implementations, including clocking, gating, and reset strategies
• Contribute to design reviews, documentation, and technical mentoring across HBM programs
• Leveraging AI to efficiently execute regular work

Required Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 6+ years of relevant industry experience, or a Master’s degree with 4+ years of relevant industry experience.
• 2 + years of experience in high‑speed digital datapath design (memory, SerDes, or SoC datapath).
• 2+ years of hands‑on experience with digital schematic build, RTL, or mixed‑signal datapath implementations.

Preferred Qualifications

• Strong understanding of HBM/DRAM architectures, including read/write data flow, timing, and multi‑channel operation.
• Working knowledge of layout and floorplanning considerations for high‑speed datapath.
• Experience with static timing analysis (STA) and timing‑closure methodologies.
• Familiarity with advanced process‑node challenges related to signal integrity, skew control, and power optimization.

Job Profile(s)

Systems Design Engineer 3 - Systems Design Engineer 4

Relocation Level

TBD

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.