Sr MEMS Engineer-M326I02

Matthews Marking Solutions LLC; Seattle (WA); On-site; USD 120,000 - 150,000; Full time

Job summary

Matthews Marking Solutions LLC is seeking a Sr MEMS Engineer to assist in development and production for wafer fabrication in an IC fabrication facility. The role involves operating silicon wafer processing and test equipment to produce silicon-based devices, with leadership in new processes and documentation.

The successful candidate will have a Bachelor's in electrical or mechanical engineering and 4+ years of IC fabrication experience, with strong data handling, safety protocol development,

Qualifications

• Bachelor’s degree required or related field preferred.
• 4+ years of experience in equipment and processing in an IC fabrication facility.

Responsibilities

• Produces production wafers and devices.
• Leads the development of new processes and procedures.
• Produces experimental wafers and executes non-standard processes.
• Creates process descriptions and documentation.
• Documents the process steps and parameters applied to specific wafers.
• Processes and parts measurements, including flatness and layer thicknesses.
• Maintains data analysis and reporting.
• Identifies unsafe situations and communicates with facility staff.
• Writes safety protocols for tools and maintains operation instructions.
• Follows procedures for bringing in new materials into the fab.

Skills

MEMS fabrication

Wafer processing

Data analysis

MS Office

Outlook

Project management

Communication

Education

Bachelor’s Degree in Electrical or Mechanical Engineering

Tools

Photolithography tools

Deposition equipment

Etch equipment

Metrology tools

Probe stations

Job description

A Sr Micro Electro Mechanical Systems (MEMS) Engineer assists in the development and production for wafer fabrication in an integrated circuit fabrication facility for MEMS devices. Involves operating silicon wafer processing and test equipment to produce silicon-based devices.

• Produces production wafers and devices.
• Leads the development of new processes and procedures.
• Produces experimental wafers and executes non-standard processes.
• Creates process descriptions and documentation.
• Documents the process steps and parameters applied to specific wafers.
• Processes and parts measurements, including flatness, layer thicknesses, and other performance parameters.
• Maintains data analysis and reporting.
• Identifies and communicates unsafe situations to the facility staff and management.
• Writes safety protocols for any tools that the company brings into the fab, including mechanical, electrical and material hazard that might occur, updating maintenance and operation instructions and training of the equipment.
• Follows procedures for bringing in any new materials into the fab.
• Additional duties as assigned.

Location(s)

4000 Mason Road125 Fluke Hall, University of Washington, Seattle , Washington 98195 , United States

Requirements

Bachelor’s Degree in electrical or mechanical engineering or related field preferred

• 4+ years of previous experience with equipment and processing in an integrated circuit fabrication facility; or equivalent combination of education and experience
• Familiar with data capture for images, storage and archive or images and ability to share them via facility and company data bases, and with Outlook.
• Training in some or all of the following areas:
• Wet bench processing including cleans (sulfuric peroxide, RCA, and resist strips)
• Photolithographic tools, including coaters, aligners, and developers
• Depositions including metal (evaporation, sputter, plating) dielectric (Thermal, CVD, PECVD, ALD, sputter)
• Etch processing including plasma (fluorine and chlorine based processes) and wet etch (KOH, TMAH, BOE, phosphoric)
• Metrology including: profilometry (Dektak, P15), film thickness (Nanospec, F-15) film resistivity, SEM
• Assembly processes including wager saw, die attach, wire bond, encapsulation and test
• Backside grind and CMP
• Wafer test, setting up and operating probe stations and electronic measurement equipment
• PZT deposition (spin coating/curling Sol Gel) and etching
• Occasional travel either locally, nationally, and/or internationally may be required.
• High degree of proficiency in MS Office Suite, Outlook & Internet applications.
• Strong analytical, prioritizing, interpersonal, problem-solving, presentation, budgeting, project management (from conception to completion), & planning skills.
• Strong verbal and written communication skills (including analysis, interpretation, & reasoning).
• Solid understanding and application of mathematical concepts.
• Ability to develop and maintain collaborative relationships with peers and colleagues across the organization, as well as, internal and external clients.
• Ability to work well autonomously and within a team in a fast-paced and deadline-oriented environment.
• Ability to work with and influence peers and management.
• Self-motivated with critical attention to detail, deadlines and reporting.

PHYSICAL ASPECTS / WORK ENVIRONMENT

Regularly required to stand; walk; sit; use hands to finger, handle, or feel; reach with hands and arms; stoop, kneel, crouch, or crawl; and talk, hear and see.

• Regularly lift and/or move up to 10 pounds. Occasionally lift and/or move up to 25 pounds.
• Specific vision abilities required by this job include close vision, distance vision, color vision, peripheral vision, depth perception, and ability to adjust focus.
• The noise level in the work environment is usually low/moderate.

* Reasonable accommodations may be made to enable individuals to perform the essential functions.

EEO is the Law