Sr. Device Engineer

GP Tech Group; Lake Forest (IL); On-site; USD 150,000 - 200,000; Full time

Job summary

GP Tech Group is seeking a Sr. Device Engineer in the Lake Forest, CA area to design, fabricate, and test wide bandgap semiconductor devices.

The role involves defining product families with sales and marketing, and leveraging Cadence, Medici, Taurus for device simulations to optimize performance. You will oversee unit process development, interface with an existing fabrication line, and supervise up to five staff members.

Qualifications

• Ph.D. in Electrical Engineering, Physics, or related field with 5–10 years of industrial experience.
• Deep understanding of wide bandgap device processing and fabrication.
• Experience with analytical characterization and electrical testing of semiconductor devices.
• Familiarity with APQP/phase-gate planning methods and FMEA.
• Strong communication, leadership, and interpersonal skills.

Responsibilities

• Design devices and fabrication processes for wide bandgap semiconductor products.
• Develop unit processes for fabrication of devices from wide bandgap materials.
• Interface with fabrication line and steward fabrication activities.
• Perform device testing and characterize electrical performance.
• Communicate results through reports and presentations.
• Collaborate with product-line, sales, and marketing teams to define markets.

Skills

Device design

Leadership

Communication

Team collaboration

Project management

Education

PhD in Electrical Engineering, Physics or related field

Tools

Cadence

Medici

Taurus

Job description

Job 131314 - Sr. Device Engineer
Lake Forest, CA

• Design, fabrication, and testing of new wide bandgap (silicon carbide, gallium nitride, etc.) semiconductor devices.
• The candidate will be responsible for designing devices and fabrication processes in order to realize new, high performance semiconductor products.
• The candidate will work with the Sales and Marketing Team to define product families and markets.
• The design activity will utilize state-of-the-art process and device simulation tools (Cadence, Medici, Taurus, etc.) to design and optimize high performance wide bandgap power semiconductor devices, including the development of accurate materials and process databases.
• The candidate will be responsible for unit process development of the specific processes necessary for fabricating devices from wide bandgap materials. The fabrication responsibility includes interfacing with an existing fabrication line, and stewarding fabrication of wide bandgap devices.
• The candidate will evaluate semiconductor device performance through semiconductor device testing, both hands-on and by working with dedicated device test groups. This will require day-to-day familiarity with standard semiconductor test equipment, including semiconductor parameter analyzers, source-measurement units and curve tracers.
• The candidate will be responsible for technical reporting of engineering and development results both by written reports and verbal presentations. The candidate must be able to communicate clearly and accurately.
• In order to maintain an on-going awareness of market and technology needs the candidate will be responsible for frequent communication with a product-line team and a sales and marketing team.
• The candidate must be able to integrate both with the wide bandgap team, and numerous teams within the fabrication facility. Good interpersonal, managerial, and organizational skills are required.
• The candidate may be required to supervise up to 5 members of the technical staff.

Requirements

• Ph.D. in Electrical Engineering, Physics, or a related field. 5-10 years industrial experience after Ph.D.
• A thorough grasp of the fundamentals of semiconductor processing and the operation of semiconductor manufacturing equipment, particularly photolithography, metallization, wet etching and dry etching and ion implantation.
• Facility with process and device simulation tools, including but not limited to Medici, Taurus, and Cadence.
• Experience with analytical characterization of semiconductor materials.
• Experience with semiconductor device testing and electrical characterization.
• Previous experience with wide bandgap semiconductors desired.
• Previous experience managing semiconductor foundry relationships for wafer fabrication desired.
• Familiarity with APQP (Advanced Product Quality Planning) or other phase-gate planning methodology, FMEA (Failure Methods and Effects Analysis) and related quality management tools.
• Punctual, meticulous, and reliable.
• Team player.
• Results oriented.
• Strong communications skills (written, verbal, presentation, and listening).
• Strong interpersonal skills.
• Strong leadership skills; can manage both direct and indirect resources.
• Able to effectively interface with different groups within the company (e.g. manufacturing, engineering, product development, and sales).
• Effectively analyzes situations; weighs alternatives – makes a decision – then executes.