Software Engineering Director/Architect, 3DIC P&R & AI-driven EDA Automation

Cadence Design Systems; Austin (TX); On-site; USD 120,000 - 180,000; Full time

Job summary

Cadence Design Systems in Austin, Texas is seeking a Software Engineer to build scalable EDA flows and AI-driven automation for advanced 3DIC applications. You will focus on flow-generation, debugging support, root-cause analysis, and platform integration for 3DIC, interposer, and RDL workflows.

The role requires strong EDA algorithm knowledge and hands-on Tcl, Python, and C++ development. Join a team delivering innovative design automation solutions in a fast-paced, collaborative environment.

Qualifications

• Strong background in EDA data structures and algorithms.
• Hands-on experience with Tcl, Python, and C++ automation in EDA tools.
• Experience with large-scale design problems, high bump-count designs, and multi-region routing.

Responsibilities

• Build scalable EDA flows using C++, Tcl, Python, and Java.
• Develop AI/LLM-based automation for 3DIC applications, including flow generation, debugging assistants, and root-cause analysis capabilities.
• Integrate 3DIC flows into a broader platform system supporting 3DIC, interposer, and RDL system flows.
• Design and automate workflows that improve usability, productivity, and debug efficiency for complex package and system-level design challenges.
• Collaborate with cross-functional engineering teams to define requirements, validate flow behavior, and deliver production-quality solutions.

Skills

Tcl

Python

C++ automation

DB-driven flows

3DIC design flows

Constraint-driven design

Large-scale design

Education

Bachelor’s or Master’s in Computer Science, Electrical Engineering, or related field

Tools

Innovus

Job description

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

We are looking for a Software Engineer to help build scalable EDA flows and AI-driven automation for advanced 3DIC applications. This role will focus on developing robust flow-generation capabilities, debugging assistance, root-cause analysis, and platform integration for 3DIC, interposer, and RDL system flows.

Core Responsibilities

• Build scalable EDA flows using C++, Tcl, Python, and Java.
• Develop AI/LLM-based automation for 3DIC applications, including flow generation, debugging assistants, and root-cause analysis capabilities.
• Integrate 3DIC flows into a broader platform system supporting 3DIC, interposer, and RDL system flows.
• Design and automate workflows that improve usability, productivity, and debug efficiency for complex package and system-level design challenges.
• Collaborate with cross-functional engineering teams to define requirements, validate flow behavior, and deliver production-quality solutions.

Required Skills

• Strong background in EDA data structures and algorithms.
• Hands-on experience with Tcl, Python, and C++ automation in EDA tools.
• Experience with DB-driven design flows, such as Innovus or similar implementation platforms.
• Understanding of 3DIC, interposer, packaging routing, and RDL design flows.
• Knowledge of constraint-driven design, including timing, signal integrity, DRC, and related implementation constraints.
• Experience handling large-scale design problems, including high bump-count designs and multi-region routing challenges.

Preferred Skills

• Experience with 3DIC, 3.5D, or 2.5D designs.
• Familiarity with signal integrity, EMIR, and thermal considerations in advanced packaging environments.
• Experience with LLM or AI systems, including agent frameworks and prompt-to-script automation.
• Knowledge of multi-tool integration and end-to-end flow automation.
• Ability to translate complex EDA workflows into scalable, user-friendly automation solutions.

Education and Experience

• Bachelor’s or Master’s degree in Computer Science, Electrical Engineering, Computer Engineering, or a related technical field.
• Relevant industry experience developing EDA software, design automation flows, AI/LLM-enabled engineering tools, or advanced packaging design solutions.

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