Signal & Power Integrity Engineer — High-Speed SI Innovator

NVIDIA Corporation; Santa Clara (CA); On-site; USD 116,000 - 219,000; Full time

Job summary

NVIDIA Corporation is seeking a Signal & Power Integrity Engineer to tackle high-speed interface challenges across NVLink, USB4, PCIe5 and GDDR6. You will model vias, connectors and substrates, develop SI guidelines, and drive accurate SI/PI analyses from lab data and simulations.

You will collaborate with cross-functional teams to optimize packages, PCBs and ASICs, using 3D EM tools (HFSS/Q3D), SIWave, VNA/TDR, and scripting to automate data processing and visualization in JMP or MATLAB.

Qualifications

• MS and/or PhD in Electrical and Computer Engineering with 2+ years experience.
• Strong background in applied electromagnetics, waveguides, transmission line theory.
• Familiarity with SI concepts, design and analysis.
• Exposure to channel SI time-domain simulations.
• Experience with 3-D modeling tools such as HFSS/Q3D and SIWave, plus 2D tools.
• Familiar with VNA, TDR, DSO, ParBERT and tools like ADS, JMP, Matlab, Cadence Allegro.
• Scripting for data post-processing and automation.

Responsibilities

• Craft SI solutions to complex system design problems.
• Model and optimize vias, connectors, sockets, breakouts in 3D EM tools.
• Run system-level SI simulations for NVLink, USB4, PCIe5, GDDR6, LP5X.
• Improve SI models using lab data and tool updates.
• Create/substrate and board layout SI guidelines; post-layout extractions.
• Automate simulations and data analysis with JMP or MATLAB.
• Collaborate cross-functionally to optimize package, PCB and ASIC.

Skills

Signal Integrity

Electromagnetics

Waveguides

Transmission Lines

Python

Data post-processing

Lab measurements

Education

MS/PhD in Electrical & Computer Engineering

Tools

ANSYS HFSS

ANSYS Q3D

ANSYS SIWave

ADS

MATLAB

JMP

Cadence Allegro

Job description

NVIDIA Corporation is seeking a Signal & Power Integrity Engineer to tackle high-speed interface challenges across NVLink, USB4, PCIe5 and GDDR6. You will model vias, connectors and substrates, develop SI guidelines, and drive accurate SI/PI analyses from lab data and simulations.

You will collaborate with cross-functional teams to optimize packages, PCBs and ASICs, using 3D EM tools (HFSS/Q3D), SIWave, VNA/TDR, and scripting to automate data processing and visualization in JMP or MATLAB.