Signal Integrity Engineer - High-Speed SI/PI & IO Design

QUALCOMM, Inc.

San Diego (CA)

Vor Ort

USD 112.000 - 167.000

Vollzeit

Vor 9 Tagen

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Zusammenfassung

Qualcomm Technologies, Inc. seeks an individual contributor in CHS Signal Integrity to own end-to-end SI/PI architecture, analysis and signoff for next-gen mobile, compute, and connectivity platforms.

You will perform high-frequency measurements with VNA/TDR, debug eye/jitter, and drive SI/PI improvements across programs. The role emphasizes pre-silicon correlations, lab data alignment, and cross-functional collaboration with packaging, systems, and board teams, in a dynamic, fast-paced

Qualifikationen

  • End-to-end SI/PI expertise with high-speed systems.
  • Experience measuring and debugging high-frequency signals.
  • Ability to drive SI/PI improvements across programs.

Aufgaben

  • Perform high-frequency measurements of passive structures using VNA and TDR.
  • Test, measure, and debug high-speed electrical signals and power delivery on active hardware.
  • Drive correlation between pre-silicon models and silicon/lab data.
  • Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions.
  • Drive adoption of best practices across programs.
  • Drive improvements in methods for system SI/PI.

Kenntnisse

VNA
TDR
High-frequency measurements
Eye/jitter debugging
Power integrity
Signal Integrity

Ausbildung

Bachelor's degree in Electrical Engineering
Bachelor's degree in Chemical Engineering
Bachelor's degree in Mechanical Engineering

Tools

VNA
TDR
Oscilloscope

Jobbeschreibung

Qualcomm Technologies, Inc. seeks an individual contributor in CHS Signal Integrity to own end-to-end SI/PI architecture, analysis and signoff for next-gen mobile, compute, and connectivity platforms.

You will perform high-frequency measurements with VNA/TDR, debug eye/jitter, and drive SI/PI improvements across programs. The role emphasizes pre-silicon correlations, lab data alignment, and cross-functional collaboration with packaging, systems, and board teams, in a dynamic, fast-paced

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