Senior Signal Integrity Engineer

Qualcomm; San Diego (CA); On-site; USD 127,000 - 191,000; Full time

Job summary

Qualcomm Technologies, Inc. in California seeks an experienced Signal Integrity/Power Integrity engineer to own end-to-end SI/PI closure across programs from pre-silicon to production. You will define targets for high-speed interfaces and guide layout guidelines while aligning with product KPIs.

The role requires hands-on expertise with HFSS, Sigrity, HSPICE and related tools, and close collaboration with SoC, package, board, and OEM teams to drive design convergence and signoff decisions.

Qualifications

• Bachelor's degree in Electrical Engineering or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Electrical Engineering or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
• PhD in Electrical Engineering or related field.

Responsibilities

• Own end-to-end SI/PI closure for programs (pre-silicon → post-silicon → production).
• Define design targets and layout design guidelines for all high-speed interfaces.
• Influence architecture decisions early in product lifecycle.
• Ensure SI/PI alignment with product KPIs (performance, yield, power, cost).
• Ensure compliance to standards (JEDEC, PCI-SIG, MIPI, IEEE).
• Lead design reviews and signoff decisions.
• Drive correlation between pre-silicon models and silicon/lab data.
• Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions.

Skills

SI/PI expertise

Jitter/noise analysis

Cross-functional collaboration

Education

B.S. in Electrical/related

M.S. in Electrical/related

PhD in Electrical/related

Tools

HFSS

ADS

Sigrity

CST

SIwave

HSPICE

Job description

Company

Qualcomm Technologies, Inc.

Job Area

Engineering Group, Engineering Group > Packaging Engineering

General Summary

This role represents an individual contributor within the CHS Signal Integrity organization responsible for end-to-end signal integrity and power integrity architecture, analysis, and signoff for next-generation mobile, compute, automotive, and various other connectivity platforms.

The engineer acts as

• System SI/PI owner across full platform (SoC package board connectors external systems)
• Technical owner for high-speed interfaces and system margins
• Cross-functional leader driving SIPI driven design convergence across silicon, package, and platform teams

Core Responsibilities

• Own end-to-end SI/PI closure for programs (pre-silicon → post-silicon → production)
• Define design targets and layout design guidelines for all high-speed interfaces
• Influence architecture decisions early in product lifecycle
• Ensure SI/PI alignment with product KPIs (performance, yield, power, cost)
• Ensure compliance to standards (JEDEC, PCI-SIG, MIPI, IEEE)
• Influence PDN architecture definition at system and package level, provide related optimum cost solutions
• Ensure cross functional alignments. Partner with SoC/PHY design teams, Package engineering, Board/system teams, and OEM/ODM ecosystem
• Lead design reviews and signoff decisions
• Represent SI/PI in program reviews and leadership forums
• Drive correlation between pre-silicon models and silicon/lab data
• Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions
• Drive adoption of best practices across programs
• Drive improvements in methods for system SI/PI

High-Speed Interface Expertise

Drive SI/PI For Interfaces Such As

• Memory: LPDDR4/5/6
• High-speed IO: PCIe Gen4/5/6/7, USB4, UFS, 10G–112G+ PHYs
• Camera/Display: MIPI CSI/DSI
• System PDN

Required Experience

• 4+ years’ experience in Signal Integrity / Power Integrity / High-speed systems

Domain Expertise

Expertise in Transmission line theory, EM fundamentals, SI/PI interactions, and jitter/noise coupling. Hands-on experience with: Tools such as HFSS, ADS, Sigrity, CST, SIwave, HSPICE; and measurement instruments such as VNA, TDR, real-time scopes

Minimum Qualifications

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.

OR

Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.

OR

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [e-mail] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay Range And Other Compensation & Benefits

$127,200.00 - $190,800.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.