Signal Integrity Engineer

QUALCOMM, Inc.

San Diego (CA)

Sur place

USD 112 000 - 167 000

Plein temps

Il y a 9 jours

Obtenez une réponse de cet employeur

Votre CV et votre lettre de motivation, adaptés exactement à ce que l’employeur recherche.

Passez les filtres ATS

Résumé du poste

Qualcomm Technologies, Inc. seeks an individual contributor in CHS Signal Integrity to own end-to-end SI/PI architecture, analysis and signoff for next-gen mobile, compute, and connectivity platforms.

You will perform high-frequency measurements with VNA/TDR, debug eye/jitter, and drive SI/PI improvements across programs. The role emphasizes pre-silicon correlations, lab data alignment, and cross-functional collaboration with packaging, systems, and board teams, in a dynamic, fast-paced

Qualifications

  • End-to-end SI/PI expertise with high-speed systems.
  • Experience measuring and debugging high-frequency signals.
  • Ability to drive SI/PI improvements across programs.

Responsabilités

  • Perform high-frequency measurements of passive structures using VNA and TDR.
  • Test, measure, and debug high-speed electrical signals and power delivery on active hardware.
  • Drive correlation between pre-silicon models and silicon/lab data.
  • Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions.
  • Drive adoption of best practices across programs.
  • Drive improvements in methods for system SI/PI.

Connaissances

VNA
TDR
High-frequency measurements
Eye/jitter debugging
Power integrity
Signal Integrity

Formation

Bachelor's degree in Electrical Engineering
Bachelor's degree in Chemical Engineering
Bachelor's degree in Mechanical Engineering

Outils

VNA
TDR
Oscilloscope

Description du poste

Company: Qualcomm Technologies, Inc.


Job Area: Engineering Group, Engineering Group > Packaging Engineering


This role represents an individual contributor within the CHS Signal Integrity organization responsible for end-to-end signal integrity and power integrity architecture, analysis, and signoff for next-generation mobile, compute, automotive, and various other connectivity platforms.


Core Responsibilities


  • Perform high-frequency measurements of passive structures using VNA and TDR

  • Test, measure, and debug high-speed electrical signals and power delivery on active hardware

  • Drive correlation between pre-silicon models and silicon/lab data

  • Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions

  • Drive adoption of best practices across programs

  • Drive improvements in methods for system SI/PI


High-Speed Interface Expertise


  • Memory: LPDDR4/5/6

  • High-speed IO: PCIe Gen4/5/6/7, USB4, UFS, 10G–112G+ PHYs

  • Camera/Display: MIPI CSI/DSI

  • System PDN


Minimum Qualifications


  • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.


Preferred Experience


  • 2+ years’ experience in Signal Integrity / Power Integrity / High-speed systems


Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).


EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.


Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.


Pay range and Other Compensation & Benefits

$111,600.00 - $167,400.00


The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play.

Obtenez votre examen gratuit et confidentiel de votre CV.

ou faites glisser et déposez votre fichier ici.

Similar jobs

Postes similaires à comparer

Signal Integrity Engineer
Signal Integrity Engineer

Qualcomm • San Diego (CA)

Sur place
USD 112 000 - 167 000
Signal Integrity Engineer
Signal Integrity Engineer

Qualcomm Incorporated • San Diego (CA)

Sur place
USD 112 000 - 167 000
Senior Signal Integrity Engineer San Diego, California, United States of America Packaging Engineering Posted a day ago
Senior Signal Integrity Engineer San Diego, California, United States of America Packaging Engineering Posted a day ago

Qualcomm • San Diego (CA)

Sur place
USD 127 000 - 191 000
Senior Signal Integrity Engineer
Senior Signal Integrity Engineer

Qualcomm • San Diego (CA)

Sur place
USD 127 000 - 191 000
Senior Signal Integrity Engineer
Senior Signal Integrity Engineer

QUALCOMM, Inc. • San Diego (CA)

Sur place
USD 127 000 - 191 000
Packaging SIPI Engineer, Principal Engineer
Packaging SIPI Engineer, Principal Engineer

Qualcomm • San Diego (CA)

Sur place
USD 202 000 - 302 000
Senior Bench Test Engineer, HSIO
Senior Bench Test Engineer, HSIO

QUALCOMM, Inc. • San Diego (CA)

Sur place
USD 118 000 - 177 000
Annual bonus
RSU grants
Senior Bench Test Engineer, HSIO
Senior Bench Test Engineer, HSIO

Qualcomm • San Diego (CA)

Sur place
USD 118 000 - 177 000
Packaging SIPI Engineer, Principal Engineer San Diego, California, United States of America Packaging Engineering
Packaging SIPI Engineer, Principal Engineer San Diego, California, United States of America Packaging Engineering

Qualcomm • San Diego (CA)

Sur place
USD 202 000 - 302 000
SIPI Engineer, Sr.
SIPI Engineer, Sr.

QUALCOMM, Inc. • San Diego (CA)

Sur place
USD 134 000 - 201 000