Signal Integrity Engineer: High‑Speed Interconnects

Amphenol Corporation; Yocumtown (PA); Sur place; USD 85 000 - 130 000; Plein temps

Résumé du poste

Amphenol High Speed Products Group seeks a Signal Integrity Engineer to join a team focused on high-speed backplane interconnects. You will design, simulate, and characterize connectors and cable-based interconnects for telecom, data center, and networking applications.

The role requires hands-on measurements with TDR and VNA, strong electromagnetic fundamentals, and collaboration with cross-functional teams to deliver robust interconnect solutions.

Qualifications

• BS in Electrical Engineering or Physics.
• Experience with frequency-domain and time-domain characterization of components and circuits.
• Experience with signal integrity measurements and debugging using TDR, VNA, pattern generators and error detectors.

Responsabilités

• Collaborate on multi-disciplinary team to develop next generation high-speed backplane interconnect products.
• Design, simulate, characterize, and apply high-speed electrical connectors and cable-based interconnects.
• Assist with customer solutions across sectors for high-speed data transmission requirements.
• Support Sales Engineers in product break-in strategies based on signal integrity expertise.
• Identify and resolve signal integrity issues in PCB layout and guide layout decisions.
• Apply circuit theory and high-speed transmission concepts to PCB layout for high-speed designs.

Connaissances

Signal integrity

TDR

VNA

EM principles

Formation

BS in Electrical Engineering

Physics

Outils

Ansys HFSS

CST Microwave

HSPICE

Matlab

ADS

Description du poste

Amphenol High Speed Products Group seeks a Signal Integrity Engineer to join a team focused on high-speed backplane interconnects. You will design, simulate, and characterize connectors and cable-based interconnects for telecom, data center, and networking applications.

The role requires hands-on measurements with TDR and VNA, strong electromagnetic fundamentals, and collaboration with cross-functional teams to deliver robust interconnect solutions.