Senior Wafer & Packaged Die Test Engineer

Astek Corporation; Colorado Springs (CO); On-site; USD 90,000 - 120,000; Full time

Job summary

Astek Corporation is seeking a Test Engineer to develop test programs for high-speed electronic components at wafer and packaged-die levels. You will understand high-speed circuitry and create robust test programs for ICs.

Ideal candidates hold a BSEE/BSCE with 5+ years in IC test engineering, strong programming and debugging skills, and experience with Verigy/Advantest 93K platforms, labs, and high-speed PLL/Serdes techniques.

Qualifications

• Degree in engineering or equivalent (4-year technical degree)
• Five years minimum experience in IC Test Engineering
• Strong programming and debug skills
• Experience testing/characterizing at wafer level
• Experience writing and using test programs for IC package test
• Proficiency in both digital and analog test methodologies
• Understanding high-speed PLL and Serdes operation
• Familiar with lab equipment and test software (LabVIEW)
• Ability to prioritize, work independently and meet program goals
• Effective communication with diverse technical teams

Responsibilities

• Develop test programs for high-speed electronic components at wafer and packaged-die levels
• Understand high-speed circuits and translate into test plans
• Create and validate Test programs for IC production testing

Skills

Programming skills

Debug skills

Communication skills

Independent work

Education

BSEE or BSCE

Tools

Verigy/Advantest 93K test platform

Job description

Astek Corporation is seeking a Test Engineer to develop test programs for high-speed electronic components at wafer and packaged-die levels. You will understand high-speed circuitry and create robust test programs for ICs.

Ideal candidates hold a BSEE/BSCE with 5+ years in IC test engineering, strong programming and debugging skills, and experience with Verigy/Advantest 93K platforms, labs, and high-speed PLL/Serdes techniques.