Consigue una respuesta de este empleador
Tu currículum y tu carta de presentación, adaptados exactamente a lo que buscan contratar.
Intel is seeking a Senior Thin Film Metrology Engineer to support 18A technology in the Thin Film Metrology area. You will drive metrology execution, develop recipes, qualify processes, own tools, and solve complex yield issues while partnering with fab, process, and TD teams to ramp and sustain production.
The role requires collaboration with Yield, TD, Process Integration, and Fab module teams to ensure readiness and continuous improvement across global HVM fabs.
MDCE (Manufacturing Development and Customer Engineering) organization is responsible for enabling advanced manufacturing capability, metrology readiness, and yield learning across Intel’s global high-volume manufacturing (HVM) fabs, including Arizona, Ireland, Israel, Oregon, and other global sites.
Job Description:
MDCE (Manufacturing Development and Customer Engineering) organization is responsible for enabling advanced manufacturing capability, metrology readiness, and yield learning across Intel’s global high-volume manufacturing (HVM) fabs, including Arizona, Ireland, Israel, Oregon, and other global sites.
As part of Intel’s IDM 2.0 strategy, MDCE plays a critical role in supporting rapid technology transitions, high volume manufacturing ramp up, and sustained manufacturing excellence for both internal products and external foundry customers.
This requisition seeks a Senior Thin Film Metrology Engineer to support 18A (1278) technology within the Thin Film Metrology area. The engineer will be responsible for driving thin film metrology execution across the segment, including recipe development, process qualification, production support, tool ownership, and technical problem solving. The role requires close collaboration with fab, process, and technology development teams to ensure successful execution throughout the early HVM ramp and sustaining production phases, while supporting the Thin Film Metrology roadmap and strategic objectives.
The selected candidate will work closely with fab module teams, Process Integration, Yield, and Technology Development (TD) organizations to ensure thin film metrology capability, readiness, and continuous improvement.
Intel offers an exceptional opportunity to work with cutting‑edge technology in a collaborative and innovative environment. This position provides a unique platform to shape the future of Intel's semiconductor solutions while directly supporting the company's efforts to meet diverse industry needs and maintain leadership in high‑volume manufacturing.
Join us in driving the next generation of semiconductor manufacturing excellence and advancing Intel's position as a global technology leader.
Experienced Hire
Shift 1 (United States of America)
US, Arizona, Phoenix
US, Oregon, Hillsboro
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
N/A
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
This role will be eligible for our hybrid work model which allows employees to split their time between working on‑site at their assigned Intel site and off‑site. * Job posting details (such as work model, location or time type) are subject to change.
Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.